10M08SAU324I7G - MAX 10 FPGA 8K LE, 324-LFBGA | Intel
Teilenummer: 10M08SAU324I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $30.5 | $3.050,00 |
| 500 | $26.8 | $13.400,00 |
| 1.000 | $23.4 | $23.400,00 |
10M08SAU324I7G Übersicht
An FPGA (field-programmable gate array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the user defines after manufacture via a hardware description language such as Verilog or VHDL. MAX 10 FPGAs occupy a hybrid position in the programmable logic hierarchy: above fixed-function ASICs in flexibility, below high-density SRAM-based FPGAs in capacity, but unique in offering instant-on capability from on-die flash configuration memory. The 10M08SAU324I7G therefore replaces multiple discrete logic ICs, PLDs, and small CPLDs in cost-sensitive embedded designs.
Key features include up to 250 user I/O pins, two integrated 12-bit ADCs supporting 1 MSPS conversion, dual 1.5/3.3 V configuration voltage support, on-die temperature sensing, and an integrated PLL with up to 4 output taps. The 324-LFBGA package exposes the largest I/O count in the 10M08 density tier, suiting industrial automation and motor control boards that require high pin density. Operating junction temperature spans the -40C to +100C industrial range with a 1.2 V core supply.
Architecturally, MAX 10 devices embed configuration flash directly on the silicon die, eliminating external boot PROMs and reducing board area. Logic elements are arranged in Logic Array Blocks (LABs) interconnected by MultiTrack interconnect, with embedded memory blocks (M9K) providing true-dual-port RAM. The fabric also includes hardware multipliers (18x18), consumer-grade PCIe hard IP, and an Nios II soft-core processor compatible path for system-on-chip designs.
Typical applications include industrial motor control, factory automation I/O expansion, video bridging, sensor fusion, low-cost prototyping, and instant-on replacement of legacy CPLD designs. The combination of flash storage, ADCs, and LVDS-capable I/O makes it well suited for IoT edge nodes that boot in under 10 ms.
When designing with the 10M08SAU324I7G, plan power rail sequencing carefully: the 1.2 V core VCC must ramp before VCCA (2.5 V PLL analog) and VCCIO (I/O banks). Use the Quartus Prime design toolchain for compilation, pin planning, and programming - the part supports JTAG (IEEE 1149.1) and Active Serial configuration modes.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, giving engineers a single reference for the 10M08SAU324I7G selection.
Drop-in-Alternativen für 10M08SAU324I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M08SAU324I7G (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Configuration Memory, Speed Grade, Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M08SAU324C8G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M08DAU324I7G
✅ Drop-In✓ Auf Lager
$22.1 / Stück
Datenblatt ansehen →10M08DAU324C8G
✅ Drop-In✓ Auf Lager
$11.4 / Stück
Datenblatt ansehen →10M16SAU324I7G
✅ Drop-In✓ Auf Lager
$32.4 / Stück
Datenblatt ansehen →10M16DAU324I7G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M04SAU324I7G
✅ Drop-In✓ Auf Lager
$16.2 / Stück
Datenblatt ansehen →10M08SAU324I7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 8000 |
| Embedded User Flash | 387,072 bits |
| General Purpose SRAM | 246 Kbits |
| PLLs | 2 (with up to 4 output taps) |
| Maximum User I/O Pins | 250 |
| On-chip ADC | Dual 12-bit, 1 MSPS |
| Core Voltage (VCC) | 1.2 V |
| Betriebsversorgungsspannung | 3 V / 3.3 V |
| Gehäuse | 324-LFBGA (UBGA-324), 15x15 mm |
| Configuration Memory | On-die flash (non-volatile) |
| Configuration Interface | JTAG (IEEE 1149.1), Active Serial |
| Betriebstemperatur | -40C to +100C (Industrial) |
| RoHS-Status | Compliant |
| Montageart | Surface Mount |
10M08SAU324I7G 324-lfbga (ubga-324), 15x15 mm Pinbelegungsleitfaden
Pinbelegung für 10M08SAU324I7G (324-lfbga (ubga-324), 15x15 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M08SAU324I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M08SAU324I7G ist geeignet für 6 Anwendungs: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Processing, Sensor Fusion and IoT Edge Nodes, Legacy CPLD Replacement (Instant-On Conversion), Medical Patient Monitoring Interfaces.
Industrial Motor Control
The 10M08SAU324I7G is well suited to industrial motor control drives because its 8000 logic elements and dual 12-bit 1 MSPS on-chip ADC can sample three-phase current feedback and implement field-oriented control (FOC) state machines in a single chip. Its 250 user I/Os handle encoder inputs, PWM outputs to gate drivers, and communication buses (RS-485, CAN, EtherCAT) without external logic. The instant-on flash configuration boots the drive in under 10 ms, meeting IEC 61800 safety startup time requirements.
Empfohlen
Factory Automation I/O Expansion
The 10M08SAU324I7G expands discrete and analog I/O channels on PLCs and distributed I/O modules. The 324-LFBGA package exposes 250 user I/Os, allowing direct termination of high-density field wiring without external shift registers. Its on-die ADCs convert 4-20 mA analog inputs, and the embedded flash stores configuration so modules retain their personality after hot-swap replacement. With 8K LE the device can host multiple industrial protocols concurrently while still leaving logic headroom for diagnostics.
Empfohlen
Video Bridging and Display Processing
The 10M08SAU324I7G bridges between CMOS camera interfaces, LVDS display panels, and HDMI/DVI controllers. Its 8000 logic elements implement pixel-clock-domain crossing, color space conversion, and frame-buffer arbitration with up to 18x18 hardware multipliers for scaling. The 324-LFBGA package offers 250 user I/Os to support wide parallel video buses (24-bit RGB, dual channel LVDS). Instant-on boot enables the display to come up with the rest of the system within 10 ms.
Empfohlen
Sensor Fusion and IoT Edge Nodes
The 10M08SAU324I7G aggregates I2C, SPI, and UART data from multiple environmental sensors and pre-processes the stream before forwarding it to a host MCU. Its dual 12-bit ADCs accept analog sensor outputs (temperature, strain gauges, light) and the embedded Nios II soft-core path implements sensor-fusion algorithms. With 387 Kbits of on-die flash it stores calibration constants and node identity, eliminating an external EEPROM and reducing the IoT node BOM by 2-3 dollars.
Empfohlen
Legacy CPLD Replacement (Instant-On Conversion)
The 10M08SAU324I7G is a drop-in instant-on replacement for aging 5 V CPLDs such as Altera MAX II/MAX V and Xilinx XC9500XL, delivering equivalent glue-logic functionality at lower power. Its on-die flash boots the design within 10 ms, satisfying industrial front-panel boot sequences where CPLDs traditionally held the system in reset until valid. Designers port legacy AHDL/VHDL designs directly to Quartus Prime and migrate to the 324-LFBGA footprint without external boot PROM.
Empfohlen
Medical Patient Monitoring Interfaces
The 10M08SAU324I7G supports medical patient monitoring equipment such as multi-parameter bedside monitors by routing ECG, SpO2, and temperature signals through its dual 12-bit ADCs and processing the digital stream in fabric. The 8K LE capacity implements digital filters (bandpass for ECG, smoothing for SpO2 photoplethysmography) without an external DSP. The industrial -40C to +100C operating range supports both operating-room and ambulance environments, while the on-die flash stores device calibration for IEC 60601-1 compliance.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M08SAU324I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M08SAU324C8G | 10M08DAU324I7G | 10M16SAU324I7G | 10M04SAU324I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-LFBGA (U324) | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same |
| Logic Elements | 8000 | 8000 | 8000 | 16000 | 4000 |
| Supply Variant | Single-supply (SAU) | Single-supply (SAU) | Dual-supply (DAU) | Single-supply (SAU) | Single-supply (SAU) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Embedded Flash | 387,072 bits | 387,072 bits | 387,072 bits | 549,888 bits | 295,296 bits |
| Max User I/O | 250 | 250 | 250 | 250 | 250 |
| On-chip ADC | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS | Dual 12-bit, 1 MSPS |
| Approx Unit Price (qty 1) | 38.50 USD | 32.00 USD | 37.20 USD | 62.00 USD | 28.40 USD |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature range with same U324 footprint (vs. 10M08SAU324C8G)
- Single-supply design eliminates external config regulator (vs. 10M08DAU324I7G)
- Lower logic capacity for cost-sensitive designs (vs. 10M16SAU324I7G)
Designhinweise
Estimated: The 10M08SAU324I7G as a single-supply SAU variant only requires VCCIO (3.3 V) and VCC (1.2 V) rails. Use a TI TPS7A4701 LDO for low-noise VCC generation. Sequence VCC (1.2 V core) before VCCA (2.5 V PLL analog) before VCCIO (3.3 V I/O). Per Intel MAX 10 datasheet, max power dissipation at 250 I/O switching at 100 MHz is approximately 1.2 W; design thermal relief accordingly.
The 324-LFBGA package uses a 1.0 mm ball pitch; PCB requires microvia stack-up with 0.4 mm laser-drilled vias. Per Intel layout guidelines, route the outer two rows of balls on the top layer only and use via-in-pad for inner rows. Match all differential pairs to 100 ohm +/- 10% impedance and keep length mismatch under 150 mil for LVDS links. Decoupling: place one 0.1 uF X7R per VCC pin, one 4.7 uF bulk per voltage plane.
Common pitfalls: (1) Do not leave JTAG TCK floating - pull to ground through 10 kohm. (2) The dual ADC inputs share the VCCA power rail; noisy VCCA directly degrades ADC SNR by 6-10 dB. (3) MSL 3 packaging requires dry-bag storage and bake-out at 125C for 24 hours before assembly if the bag is opened more than 168 hours before reflow. (4) Do not use the configuration pins as regular I/O unless the MSEL pins are set to JTAG-only mode.
Compliance-Informationen
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - this is an industrial-grade FPGA. Conflict-minerals declaration compliant per Intel supply chain policy.
