10M08DAU324I7G vs 10M16DAU324I7P Vergleich
Detaillierter Direktvergleich von 10M08DAU324I7G von Intel und 10M16DAU324I7P von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DAU324I7G | 10M16DAU324I7P |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,10 | $51,20 |
| Series | MAX 10 | — |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory (M9K blocks) | 378 Kbits | — |
| User Flash Memory | 387,072 bits | [DATA_NEEDED: user flash size] |
| Maximum User I/O | 246 | — |
| Gehäuse | 324-LFBGA (UBGA), 1.0 mm pitch | 324-LFBGA (UBGA-324) |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Supply Voltage (Core) | 1.2 V typical | — |
| Supply Voltage (I/O Banks) | 1.2 V to 3.3 V | — |
| Process Technology | TSMC 55 nm embedded flash | — |
| DSP Blocks (18x18 Multipliers) | 24 | — |
| PLLs | 4 | — |
| On-chip ADC | Dual 12-bit, 1 MSPS | — |
| Configuration | Internal flash, JTAG, Passive Serial | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 | — |
| Family | — | MAX 10 |
| Logic Elements | — | 16000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| User I/O Count | — | 246 |
| Embedded Memory | — | 549 kbit |
| Embedded Multipliers (18x18) | — | 246 |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +100 C |
| Speed Grade | — | 7 |
| Temperature Grade | — | Industrial (I) |