10M25DAF484C8G vs 10M08DAF484C8G Vergleich
Detaillierter Direktvergleich von 10M25DAF484C8G von Intel und 10M08DAF484C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DAF484C8G | 10M08DAF484C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $50,00 | $27,65 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | — |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | 55 nm |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Gehäuse | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount | — |
| Betriebstemperatur | 0 °C to 85 °C (Commercial) | — |
| Speed Grade | -8 | -C8 |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | 8-channel, 12-bit |
| PLLs | Yes (up to 4 analog PLLs per device) | 2 |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Logic Elements (LE) | — | 8000 |
| Embedded Memory | — | 387,072 bits (378 Kbits) |
| User Flash | — | 1,540 Kbits |
| Maximum User I/O | — | 250 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage | — | 1.2 V to 3.3 V |
| Betriebs-Sperrschichttemperatur | — | -40 C to +100 C (industrial) |
| Configuration | — | Internal flash, dual-configuration, RSU support |
| DSP Blocks | — | Yes |