10M25DAF484C8G vs 10M08DAF484C8G Comparison
Detailed side-by-side comparison of 10M25DAF484C8G by Intel and 10M08DAF484C8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M25DAF484C8G | 10M08DAF484C8G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $50.00 | $27.65 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | — |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | 55 nm |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Package | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | — |
| Operating Temperature | 0 °C to 85 °C (Commercial) | — |
| Speed Grade | -8 | -C8 |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | 8-channel, 12-bit |
| PLLs | Yes (up to 4 analog PLLs per device) | 2 |
| RoHS Status | Compliant | Compliant |
| MSL Level | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Logic Elements (LE) | — | 8000 |
| Embedded Memory | — | 387,072 bits (378 Kbits) |
| User Flash | — | 1,540 Kbits |
| Maximum User I/O | — | 250 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage | — | 1.2 V to 3.3 V |
| Operating Junction Temperature | — | -40 C to +100 C (industrial) |
| Configuration | — | Internal flash, dual-configuration, RSU support |
| DSP Blocks | — | Yes |