10M25DAF484C8G vs 10M08DAF484C8G 对比

详细并排对比 10M25DAF484C8G 出自 Intel 和 10M08DAF484C8G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M08DAF484C8G 10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel

10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel

10M08DAF484C8G ✓ 量产中

规格对比

参数 10M25DAF484C8G 10M08DAF484C8G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $50.00 $27.65
Family MAX 10 MAX 10
Logic Elements 25,000 —
Embedded Memory (Kbits) 1638 —
User I/O Count 360 —
Process Technology 55 nm CMOS 55 nm
Core Supply Voltage (VCCINT) 1.2 V (1.15 V min / 1.25 V max) —
封装 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch 484-ball FBGA (FineLine BGA)
安装类型 Surface Mount —
工作温度 0 °C to 85 °C (Commercial) —
Speed Grade -8 -C8
Configuration Memory On-chip dual-configuration flash —
ADC Integrated 12-bit ADC (where enabled) 8-channel, 12-bit
PLLs Yes (up to 4 analog PLLs per device) 2
RoHS 状态 Compliant Compliant
MSL 等级 MSL3 —
Number of I/O Banks 8 (per F484 pinout) —
Logic Elements (LE) — 8000
Embedded Memory — 387,072 bits (378 Kbits)
User Flash — 1,540 Kbits
Maximum User I/O — 250
Core Voltage — 1.2 V
I/O Bank Voltage — 1.2 V to 3.3 V
工作结温 — -40 C to +100 C (industrial)
Configuration — Internal flash, dual-configuration, RSU support
DSP Blocks — Yes

数据手册与资源

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