10M25DAF484C8G vs 10M25DAF484C7G Vergleich
Detaillierter Direktvergleich von 10M25DAF484C8G von Intel und 10M25DAF484C7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DAF484C8G | 10M25DAF484C7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $50,00 | $38,50 |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | — |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Gehäuse | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-BGA (F484) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0 °C to 85 °C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | -8 | — |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 4 general-purpose |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Series | — | MAX 10 |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory (M9K blocks) | — | 1,728 Kbit |
| Embedded 18x18 Multipliers | — | 66 |
| User I/O Pins (max) | — | 360 |
| On-chip Configuration Flash | — | Dual-configuration (instant-on, remote update) |
| Hard IP: ADC | — | 12-bit, 1 MSPS, 16-channel (MAX 10 family) |
| Global Clocks | — | 20 |
| On-chip Temperature Sensor | — | Yes |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |