10M25DAF484C8G vs 10M25DAF484C7G Comparación
Comparación detallada lado a lado de 10M25DAF484C8G por Intel y 10M25DAF484C7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M25DAF484C8G | 10M25DAF484C7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $50,00 | $38,50 |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | — |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Encapsulado | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-BGA (F484) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0 °C to 85 °C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | -8 | — |
| Configuration Memory | On-chip dual-configuration flash | — |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 4 general-purpose |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Series | — | MAX 10 |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory (M9K blocks) | — | 1,728 Kbit |
| Embedded 18x18 Multipliers | — | 66 |
| User I/O Pins (max) | — | 360 |
| On-chip Configuration Flash | — | Dual-configuration (instant-on, remote update) |
| Hard IP: ADC | — | 12-bit, 1 MSPS, 16-channel (MAX 10 family) |
| Global Clocks | — | 20 |
| On-chip Temperature Sensor | — | Yes |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |