10M40DCF484I7G - MAX 10 FPGA, 40K LE, 484-FBGA | Intel
Teilenummer: 10M40DCF484I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $129.97 | $129,97 |
| 10 | $116.97 | $1.169,70 |
| 100 | $97.48 | $9.748,00 |
| 500 | $81.23 | $40.615,00 |
| 1.000 | $71.48 | $71.480,00 |
10M40DCF484I7G Übersicht
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that designers can configure after manufacturing to implement arbitrary digital circuits. FPGAs sit within the semiconductor hierarchy between ASICs (which are fixed-function) and microcontrollers (which run software), making them ideal for parallel processing, custom interface bridging, hardware acceleration, and rapid prototyping.
Key features of the 10M40DCF484I7G include 1,290,240 bits of embedded SRAM (Kb memory), 4 PLLs, 2 I/O banks with LVDS support, an integrated ADC block, and a 1.2 V core supply. The 'DC' package code indicates a commercial-grade temperature range, while the 'I7' speed grade and 'G' lead-free finish complete the part designation per Altera/Intel ordering nomenclature.
The MAX 10 architecture combines LUT-based logic fabric with hardened peripherals including DDR3 memory controllers, soft processors (Nios V), and on-die configuration flash, enabling single-chip system designs. Unlike SRAM-based Cyclone or Stratix devices, MAX 10 is instant-on at power-up with no external boot device required, simplifying PCB layout and reducing BOM cost.
Typical applications include industrial motor control, factory automation I/O expansion, video processing pipelines, low-cost custom protocol bridging, and prototype ASIC emulation. The 484-ball FBGA package with 1.0 mm pitch is well-suited for moderate-density designs where high I/O count is required but full FPGA BGA assembly is acceptable.
When designing with this device, ensure the Quartus Prime software version supports the 10M40DCF484I7G device variant. Verify the IBIS model and pinout file against your PCB layout, and follow Intel's MAX 10 hardware design guidelines for power rail sequencing, decoupling, and JTAG chain implementation.
This page synthesizes distributor pricing, same-family MAX 10 drop-in alternatives, and practical Quartus Prime design notes not found in a single manufacturer datasheet.
Drop-in-Alternativen für 10M40DCF484I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M40DCF484I7G (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Configuration Memory, On-chip ADC, PLLs.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M40DCF484C8G
✅ Drop-In✓ Auf Lager
$53.9 / Stück
Datenblatt ansehen →10M40DCF484C7G
✅ Drop-In✓ Auf Lager
$124.2 / Stück
Datenblatt ansehen →10M25DCF484I7G
✅ Drop-In✓ Auf Lager
$45.1 / Stück
Datenblatt ansehen →10M16DCF484I7G
✅ Drop-In✓ Auf Lager
$43.95 / Stück
Datenblatt ansehen →10M40DAF484C7G
✅ Drop-In✓ Auf Lager
$92.4 / Stück
Datenblatt ansehen →10M08DCF484I7G
✅ Drop-In✓ Auf Lager
$28.2 / Stück
Datenblatt ansehen →10M40DCF484I7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements | 40,000 |
| Embedded Memory | 1,290,240 bits (Kb) |
| User I/O Count | 360 |
| Gehäuse | 484-FBGA (FineLine BGA, 23 x 23 mm, 1.0 mm pitch) |
| Process Technology | 55 nm CMOS |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 472.5 MHz |
| PLLs | 4 |
| I/O Banks | 2 (with LVDS support) |
| Configuration Memory | On-chip flash (instant-on, no external boot PROM) |
| Temperature Grade | Commercial (DC suffix) |
| Speed Grade | I7 |
| Lead-Free Finish | Yes (G suffix) |
| RoHS-Status | Compliant |
10M40DCF484I7G 484-fbga (fineline bga, 23 x 23 mm, 1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für 10M40DCF484I7G (484-fbga (fineline bga, 23 x 23 mm, 1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M40DCF484I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M40DCF484I7G ist geeignet für 6 Anwendungs: Industrial Motor Control, Factory Automation I/O Expansion, Video Processing and Bridging, Custom Protocol Bridging and Interface Conversion, ASIC Prototyping and Hardware Emulation, LED Lighting and Display Control.
Industrial Motor Control
The Intel MAX 10 10M40DCF484I7G is well-suited for industrial motor control designs requiring deterministic PWM generation and feedback loop processing. The 40,000 logic elements handle multi-axis FOC algorithms, while the 4 PLLs generate precise clock trees for encoder interfaces and PWM synchronization. Its 360 user I/O pins connect directly to gate drivers, Hall sensors, and resolver decoders without external muxing. The integrated 12-bit ADC block samples motor currents and bus voltages synchronously with the PWM carrier, reducing external component count. Compared to MCU-only solutions, the FPGA fabric enables sub-microsecond control loops critical for high-speed spindle and servo applications. The 1.2 V core and 55 nm CMOS process balance performance with thermal efficiency in enclosed IP54 enclosures.
Empfohlen
Factory Automation I/O Expansion
For factory PLC expansion and industrial I/O aggregation, the 10M40DCF484I7G provides 360 user I/O that can be configured as LVDS, LVCMOS, or differential pairs to interface with sensors, actuators, and fieldbus transceivers. The non-volatile on-chip flash enables instant-on configuration critical for deterministic boot in safety systems. Its 4 PLLs generate isolated clock domains for EtherCAT, PROFINET, or EtherNet/IP IP cores running in the fabric. The 484-FBGA package supports dense PCB layouts with controlled impedance routing for high-speed differential signals. Designers can integrate soft-core processors (Nios V) for protocol stack handling while using hardened peripherals for real-time I/O. The industrial temperature range supports deployment in factory floor environments with ambient temperatures up to +100C.
Empfohlen
Video Processing and Bridging
The 10M40DCF484I7G handles video processing pipelines including format conversion, scaling, and bridging between MIPI CSI-2, LVDS, RGB, and HDMI interfaces. The 40K logic elements absorb frame-buffer management and color-space conversion logic, while the 1.29 Mbit embedded SRAM provides line buffers and lookup tables for gamma correction. Its 360 user I/O support parallel video buses up to 24-bit color depth at typical display resolutions. The integrated DDR3 memory controller connects to external SDRAM for full-frame buffering in multi-camera applications. The MAX 10 instant-on feature is valuable in display products that must wake quickly from standby. Compared to ASIC-based video processors, the FPGA offers firmware-updatable feature sets and late-stage customization.
Empfohlen
Custom Protocol Bridging and Interface Conversion
The 10M40DCF484I7G excels at protocol bridging between incompatible interfaces such as SPI to I2C, UART to CAN, or parallel to LVDS. Its 40K logic elements implement complex state machines for protocol translation while the 4 PLLs provide the multiple clock domains required when bridging interfaces of different speeds. The 360 user I/O pins accommodate multiple parallel data buses simultaneously, enabling fan-out and aggregation designs. Its non-volatile configuration simplifies deployment in embedded OEM modules where external boot PROMs are impractical. Engineers use the FPGA to bridge legacy microcontrollers to modern high-speed peripherals, or to add missing interfaces to SoCs that lack specific I/O. Quartus Prime IP catalog accelerates development with pre-verified protocol cores.
Empfohlen
ASIC Prototyping and Hardware Emulation
Designers use the 10M40DCF484I7G as an ASIC prototyping vehicle for pre-silicon validation of digital logic blocks, especially for designs targeting 100K-200K gate equivalents. The 40K logic elements map comfortably to mid-complexity ASIC functions, while the 484-FBGA package provides 360 I/O for emulating wide bus interfaces. Multiple MAX 10 devices can be cascaded via LVDS to emulate larger ASICs. The Quartus Prime synthesis toolchain supports rapid HDL iteration, and the on-chip flash allows fast in-system reprogramming during bring-up. This approach catches logic bugs months before ASIC tape-out, dramatically reducing respin risk. The industrial temperature grade also enables field prototype testing in harsh environments.
Empfohlen
LED Lighting and Display Control
Large LED walls, architectural lighting, and digital signage benefit from the 10M40DCF484I7G's high I/O count and parallel processing capability. The 360 user I/O pins drive hundreds of LED driver channels directly via PWM, supporting per-pixel color and brightness control. The 4 PLLs generate multiple PWM frequencies for different LED driver ICs, while the 40K logic elements handle video input parsing, color mapping, and gamma correction in real time. The integrated DDR3 controller buffers video frames for smooth playback. The non-volatile instant-on feature enables display walls to boot and display test patterns without external boot devices. Compared to MCU-based LED controllers, the FPGA delivers 10-100x the channel capacity per board.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M40DCF484I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M40DCF484C8G | 10M40DCF484C7G | 10M25DCF484I7G | 10M16DCF484I7G | 10M40DAF484C7G |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 40,000 | 40,000 (same) | 40,000 (same) | 25,000 (-37.5%) | 16,000 (-60%) | 40,000 (same) |
| User I/O | 360 | 360 (same) | 360 (same) | 360 (same) | 360 (same) | 360 (same) |
| Embedded Memory (Kb) | 1,290 | 1,290 (same) | 1,290 (same) | 810 (-37%) | 504 (-61%) | 1,290 (same) |
| PLLs | 4 | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 4 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (same) | Industrial (same) | Commercial (0C to +85C) |
| Speed Grade | I7 | C8 | C7 | I7 (same) | I7 (same) | C7 |
| On-chip Configuration Flash | Yes | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
Wichtigste Unterscheidungsmerkmale
- Non-volatile on-chip configuration flash eliminates external boot PROM (vs. Xilinx Artix-7 (XC7A100T series))
- Industrial temperature grade with full 360 user I/O in 484-FBGA (vs. Lattice ECP5 LFE5U-25F-8BG256I)
- Largest logic capacity in 484-FBGA MAX 10 family with industrial temp (vs. 10M25DCF484I7G)
Designhinweise
Estimated: The 484-ball FBGA package uses 1.0 mm ball pitch, which requires 4-layer or 6-layer PCB stackup with microvia or via-in-pad construction for reliable assembly. Recommended stackup per Intel MAX 10 hardware design guide is FR-4 with 8 mil dielectric between top signal layer and first inner ground plane. All 484 balls should be connected to inner ground or power planes via stitching vias to control impedance. Decoupling capacitors (100 nF and 10 uF) must be placed within 100 mils of each power pin pair to suppress switching transients. JTAG and configuration pins should be routed to a 0.1 inch header for programming access.
Estimated: At typical utilization of 70% logic elements switching at 100 MHz toggle rate, the 10M40DCF484I7G core draws approximately 0.8-1.2 A from the 1.2 V supply, dissipating roughly 1.0-1.5 W. Add I/O supply current (3.3 V at up to several hundred mA depending on I/O activity) for total board power. Designers should provide a switching regulator with at least 20% current headroom and use a ferrite bead plus bulk capacitor network on each supply rail. Power sequencing is not required for MAX 10 devices, but VCCIO must be stable before VCCINT ramps to avoid latch-up.
Common pitfall: Designers migrating from Cyclone IV/V to MAX 10 often forget that MAX 10 has on-chip flash configuration and does not require an external EPCQ boot PROM. Another pitfall: the MAX 10 device ID in JTAG chain differs from older Altera families - update your JTAG programmer scripts accordingly. Quartus Prime version 18.0 or later is required for MAX 10 device support; older Quartus versions do not recognize the 10M40DCF484I7G device ID. Always verify the .sof programming file targets the correct device variant before in-system programming.
Compliance-Informationen
RoHS and REACH compliant per Intel product declaration. Lead-free (Pb-free) finish indicated by G suffix. Not AEC-Q100 qualified - this is a commercial/industrial grade FPGA. For automotive applications requiring AEC-Q100, consider MAX 10 automotive variants (10M0xDAFxxxA7G) with explicit 'A' designation.
