10M50SAE144C8G vs 10M50SCE144A7G Vergleich
Detaillierter Direktvergleich von 10M50SAE144C8G von Intel und 10M50SCE144A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M50SAE144C8G | 10M50SCE144A7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $47,90 | $12,85 |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 50000 | 50,000 |
| Embedded Memory | 1677312 bits (approx. 1.6 Mbit) | — |
| Maximum User I/Os | 101 | — |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144) | — |
| Package Dimensions | 22 x 22 mm, 0.50 mm pitch | — |
| Betriebstemperatur | 0C to +85C (Commercial, "C8" grade) | -40C to +100C (industrial) |
| Supply Voltage - Core | [DATA_NEEDED: core Vcc] | 1.2 V (internal) |
| Process Technology | 55 nm embedded flash CMOS | TSMC 55 nm NOR-flash + SRAM |
| Configuration | Non-volatile, single-chip (on-chip flash) | — |
| On-chip User Flash | Up to 1.4 Mbit | — |
| ADC | 12-bit successive-approximation, up to 17 channels | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| I/O Standards | LVCMOS, LVDS, SSTL, RSDS, PCI | — |
| Hot Socketing | Yes | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 | 3 (per JEDEC J-STD-020) |
| Thermal Resistance (Theta-JA) | [DATA_NEEDED: theta-JA C/W] | — |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count and total bits] |
| Total User Flash Bits | — | 1,677,312 bits |
| User I/O Count | — | 101 |
| Number of LABs/CLBs | — | 3,125 |
| Supply Voltage - I/O | — | 3.0 V / 3.3 V LVCMOS/LVTTL |
| Gehäuse / Bauform | — | 144-LQFP Exposed Pad (EQFP-144) |
| Number of PLLs | — | 2 |
| Integrated ADC | — | 12-bit, 1 MSPS (analog inputs package-dependent) |
| Configuration Method | — | On-chip non-volatile flash (instant-on, no external boot PROM) |