10M50SAE144C8G vs 10M50SCE144A7G Сравнение
Подробное сравнение бок о бок 10M50SAE144C8G от Intel и 10M50SCE144A7G от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | 10M50SAE144C8G | 10M50SCE144A7G |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $47,90 | $12,85 |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 50000 | 50,000 |
| Embedded Memory | 1677312 bits (approx. 1.6 Mbit) | — |
| Maximum User I/Os | 101 | — |
| Корпус | 144-LQFP Exposed Pad (EQFP-144) | — |
| Package Dimensions | 22 x 22 mm, 0.50 mm pitch | — |
| Рабочая температура | 0C to +85C (Commercial, "C8" grade) | -40C to +100C (industrial) |
| Supply Voltage - Core | [DATA_NEEDED: core Vcc] | 1.2 V (internal) |
| Process Technology | 55 nm embedded flash CMOS | TSMC 55 nm NOR-flash + SRAM |
| Configuration | Non-volatile, single-chip (on-chip flash) | — |
| On-chip User Flash | Up to 1.4 Mbit | — |
| ADC | 12-bit successive-approximation, up to 17 channels | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| I/O Standards | LVCMOS, LVDS, SSTL, RSDS, PCI | — |
| Hot Socketing | Yes | — |
| Тип монтажа | Surface Mount | Surface Mount |
| Статус RoHS | Compliant | Compliant |
| Уровень MSL | 3 | 3 (per JEDEC J-STD-020) |
| Thermal Resistance (Theta-JA) | [DATA_NEEDED: theta-JA C/W] | — |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count and total bits] |
| Total User Flash Bits | — | 1,677,312 bits |
| User I/O Count | — | 101 |
| Number of LABs/CLBs | — | 3,125 |
| Supply Voltage - I/O | — | 3.0 V / 3.3 V LVCMOS/LVTTL |
| Корпус / Типоразмер | — | 144-LQFP Exposed Pad (EQFP-144) |
| Number of PLLs | — | 2 |
| Integrated ADC | — | 12-bit, 1 MSPS (analog inputs package-dependent) |
| Configuration Method | — | On-chip non-volatile flash (instant-on, no external boot PROM) |