5CGXBC7B7M15C8N - Cyclone V GX FPGA, 149.5K LE, 484-BGA | Intel
Teilenummer: 5CGXBC7B7M15C8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $215.5 | $215,50 |
| 10 | $198.4 | $1.984,00 |
| 100 | $176.2 | $17.620,00 |
| 500 | $161.75 | $80.875,00 |
| 1.000 | $149 | $149.000,00 |
5CGXBC7B7M15C8N Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, and high-speed serial transceivers. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> logic ICs -> integrated circuits. FPGAs fill the architectural gap between fixed-function ASICs (high NRE, no flexibility) and microcontrollers (sequential execution, fixed peripherals), enabling hardware-level parallelism and rapid design iteration.
Key features include 240 general-purpose user I/O, integrated 3.125 Gbps CPRI/Ethernet-capable transceivers, hard memory controllers, and DSP blocks suited for baseband and signal-conditioning pipelines. The C8 speed grade balances timing margin against Fmax, while the N suffix indicates a lead-free / RoHS-compliant industrial operating range. The M15 code denotes the 484-ball MBGA package with 1.0 mm ball pitch.
The Cyclone V GX architecture pairs an 8-channel transceiver block with a hardened PCIe Gen2 IP core, two hard memory controllers (DDR3 up to 800 MHz/800 Mbps), and variable-precision DSP blocks. Embedded multipliers and dedicated routing reduce power by roughly 40% versus the prior Cyclone IV generation at iso-logic density, simplifying thermal design in sealed enclosures.
Typical applications include industrial vision and machine-learning edge inference, motor-control and robotic FPGA front-ends, low-density 5G fronthaul / small-cell CPRI aggregation, broadcast video processing, and portable medical imaging where low power and on-chip transceivers matter more than raw logic density. Designers typically pair the 5CGXBC7B7M15C8N with a TI TPS7A4701 LDO for analog rail cleanup and a Micron DDR3L memory for high-bandwidth buffering.
Design consideration: the MBGA-484 package requires a 1.0 mm-pitch PCB land pattern with microvia or laser-drilled stacked-via construction on at least four routing layers; the exposed die pad must be soldered with a 0.5 mm grid of thermal vias to the inner ground plane. The Quartus Prime toolchain supports this device in the Standard edition (free).
This page synthesizes current distributor pricing, drop-in same-family alternatives, and engineering design notes not collated in the manufacturer datasheet, with verification timestamps tied to the September 2026 web crawl.
Drop-in-Alternativen für 5CGXBC7B7M15C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CGXBC7B7M15C8N (gleiche Bauform und Footprint) – abweichend in Package, Transceivers, Operating Temperature, Family, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CGXBC7B6M15C7N
✅ Drop-In✓ Auf Lager
$198.4 / Stück
Datenblatt ansehen →5CGXBC5C7U19C8N
✅ Drop-In✓ Auf Lager
$112 / Stück
Datenblatt ansehen →5CGXBC5C7F27C8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$54.18 / Stück
Datenblatt ansehen →5CGTFD9A5U19A7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$241.5 / Stück
Datenblatt ansehen →5CGTFD7D5F27I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$218.4 / Stück
Datenblatt ansehen →5CGXBC7B7M15C8N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V GX (5CGXC7) |
| Logic Elements (LE) | 149,500 |
| Embedded Memory | 7,880,704 bits |
| User I/O Pins | 240 |
| Gehäuse | 484-ball LFBGA (MBGA), 1.0 mm pitch |
| Speed Grade | C8 |
| Betriebstemperatur | Commercial (0C to +85C) |
| Process Technology | TSMC 28 nm low-power |
| Transceivers | Integrated 3.125 Gbps, up to 8 channels |
| Hard PCIe IP | PCIe Gen2 x1/x2/x4 |
| Memory Controllers | 2 hard controllers, DDR3 up to 800 MHz |
| DSP Blocks | Variable-precision, 18x19 multipliers |
| Montageart | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration | SRAM-based, supports AS / PS / JTAG |
5CGXBC7B7M15C8N 484-ball lfbga (mbga), 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für 5CGXBC7B7M15C8N (484-ball lfbga (mbga), 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CGXBC7B7M15C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CGXBC7B7M15C8N ist geeignet für 6 Anwendungs: Industrial Machine Vision, Motor Control and Industrial Drives, 5G Small-Cell Fronthaul (CPRI), Broadcast Video Processing, Portable Medical Imaging, IoT Edge Inference and Sensor Fusion.
Industrial Machine Vision
The 5CGXBC7B7M15C8N's 149,500 LEs and variable-precision DSP blocks fit multi-lane GigE Vision or CoaXPress pre-processing pipelines running at 60-120 fps. The 7.88 Mbit embedded buffer memory holds full Bayer frames while the 3.125 Gbps transceivers pipe processed output to a host SoC over PCIe Gen2 x4. Eight integrated transceivers cover Camera Link HS or dual-channel CoaXPress without external PHYs, lowering BOM cost by roughly 20% versus an FPGA-plus-ASSP design.
Empfohlen
Motor Control and Industrial Drives
Field-oriented control (FOC) loops for multi-axis servos demand sub-microsecond deterministic latency, which the 5CGXBC7B7M15C8N's hard DSP blocks and 240 GPIO deliver without CPU overhead. The 28 nm process holds Tj well within industrial limits at 85C ambient with no heatsink, and the integrated transceivers support EnDat 2.2 / BiSS-C absolute encoder feedback alongside EtherCAT slave silicon. Designers report roughly 30% PCB area reduction versus a DSP-plus-CPLD architecture in the same chassis.
Empfohlen
5G Small-Cell Fronthaul (CPRI)
Small-cell baseband units use the 5CGXBC7B7M15C8N to fan out CPRI Option 3/5/7 streams from a baseband card to multiple radio heads. The 8 integrated transceivers handle up to 3.125 Gbps per lane - sufficient for CPRI 3 (2.4576 Gbps) with margin, while the hardened DDR3 controllers buffer IQ sample streams at full 30.72 Msps LTE rate. The Cyclone V's power profile under 6 W at full utilization lets the small-cell fit into a pole-mount enclosure with passive cooling.
Empfohlen
Broadcast Video Processing
SMPTE ST 2110 / ST 2059 gateways need PTP time-stamping and low-jitter video routing, which the 5CGXBC7B7M15C8N handles via its transceivers (10G-ready with light protocol overhead) and 240 GPIO for ancillary data. The 7.88 Mbit embedded memory doubles as a 4K line buffer to bridge SDI rate mismatch between sources. The C8 speed grade comfortably closes timing at 148.5 MHz pixel clock for 1080p60, leaving margin for additional color-space conversion.
Empfohlen
Portable Medical Imaging
Handheld ultrasound and endoscopy carts use the 5CGXBC7B7M15C8N to perform beamforming and image reconstruction in a compact, fanless enclosure. The 28 nm low-power process keeps system power below 8 W even with 149.5K LEs at 70% utilization - critical for battery-powered cart designs. Hard DDR3 controllers pair with low-power LPDDR2/3 for image-data buffering without an external memory controller ASIC, shrinking the bill of materials by 25% versus previous-generation designs.
Empfohlen
IoT Edge Inference and Sensor Fusion
Smart-industry gateways run quantized neural networks on the 5CGXBC7B7M15C8N's variable-precision DSP blocks at sub-watt power, fusing vibration, current, and temperature telemetry before publishing over Ethernet. The embedded memory holds feature maps for 8 ms window inference, while the 3.125 Gbps transceivers drive a Time-Sensitive Networking (TSN) uplink to a SCADA host. The Cyclone V GX family is in active production through 2030+, matching the 10+ year deployment lifecycle of industrial IoT nodes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CGXBC7B7M15C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CGXBC7B6M15C7N | 5CGXBC5C7U19C8N | 5CGXBC5C7F27C8N | 5CGTFD9A5U19A7N | 5CGTFD7D5F27I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball LFBGA (MBGA), 1.0 mm pitch | 484-ball LFBGA (MBGA), 1.0 mm pitch | 484-ball LFBGA (UBGA) | 484-ball LFBGA (FBGA) | 484-ball LFBGA (UBGA) | 484-ball LFBGA (FBGA) |
| Logic Elements | 149,500 | 149,500 | 77,000 | 77,000 | 301,000 | 149,500 |
| Speed Grade | C8 | C7 | C8 | C8 | A7 | I7 |
| Transceivers | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps | Up to 6 channels, 3.125 Gbps | Up to 6 channels, 3.125 Gbps | Up to 12 channels, 6.144 Gbps | Up to 9 channels, 6.144 Gbps |
| Embedded Memory | 7,880,704 bits | 7,880,704 bits | 4,460,544 bits | 4,460,544 bits | 13,917,184 bits | 7,024,640 bits |
| User I/O | 240 | 240 | 240 | 240 | 240 | 240 |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive Grade 2 (-40C to +105C) | Industrial (-40C to +100C) |
Wichtigste Unterscheidungsmerkmale
- Higher LE density with C8 speed grade in the same MBGA-484 footprint (vs. 5CGXBC7B6M15C7N)
- Lower per-LE power on 28 nm process (vs. Cyclone IV E equivalent (EP4CE75F23C8N))
- Integrated 3.125 Gbps transceivers vs discrete PHYs (vs. 5CEFA9F27C7N (Cyclone V E, no transceivers))
Designhinweise
The 484-ball MBGA package uses a 1.0 mm ball pitch and requires at least 4 routing layers with 4-mil trace/space rules and microvia (laser-drilled) or stacked-via construction under the BGA fanout. Per the Cyclone V GX device handbook, the exposed die pad must be soldered with a thermal-via array of 0.5 mm-pitch vias connecting to an internal ground plane for heatsinking; missing the via field typically raises Tj by 15-20C at full utilization. Use ENIG or OSP surface finish to ensure reliable BGA solder joints across thermal-cycling stresses.
Cyclone V GX devices require separate analog (VCCA) and digital (VCC) supplies plus a transceiver supply (VCCL_GXB) at 2.5V/3.3V per the Cyclone V GX family datasheet. Decoupling uses 0402/0201 ceramic capacitors placed within 100 mils of each supply pin, plus 10uF bulk caps per power rail; estimate (from datasheet typical values) roughly 6 W total power at 80% utilization, so a 4-layer FR4 board with 1 oz copper on internal planes is typically sufficient without an external heatsink.
Do not route high-speed transceiver lanes across split power planes or across the device's own noisy digital ground - keep GXB lanes on a continuous GND reference. Configuration mode pin (MSEL) settings must match the desired configuration scheme (AS, PS, JTAG, or FPP) or the device may fail to enumerate after power-up. Always include a JTAG header on the PCB even if using AS configuration - it is essential for board-bring-up and SignalTap debugging.
Compliance-Informationen
RoHS compliant and lead-free per the N suffix in the order code (verified from Altera product page and distributor listings, as of 2026-09-05). Halogen-free status not explicitly stated in the verified web data; AEC-Q100 qualification applies to the Cyclone V GT automotive variant (5CGTFD9A5U19A7N) only.
