5CSEBA4U19C6N vs 5CSEBA4U19A7N Vergleich

Detaillierter Direktvergleich von 5CSEBA4U19C6N von Intel und 5CSEBA4U19A7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 5CSEBA4U19C6N 5CSEBA4U19A7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $74,50 $99,90
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 40,000 (40K LE) 40 K
Hard Processor System (HPS) Dual-core ARM Cortex-A9 MPCore with CoreSight —
Maximum HPS Clock Frequency 925 MHz —
Gehäuse 484-pin UFBGA / UBGA (19x19 mm) 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
FPGA User I/O 161 (per Altera product page) —
Process Technology TSMC 28 nm low-power —
Memory Controller Hard controller for DDR2 / DDR3 / LPDDR2 —
DSP Blocks Variable-precision DSP blocks (18x18 multipliers) —
Embedded Memory M10K memory blocks 3.4 Mbits (M9K)
Encryption Support AES encryption (per LCSC listing) —
Error Detection SEU error detection and correction support —
Betriebstemperatur 0C to +85C (commercial grade) —
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS-Status Compliant Compliant
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Betriebs-Sperrschichttemperatur — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Core Voltage — 1.1 V (typical)
MSL-Level — 3 (168 hours)

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