A3P250-2FGG144 vs A3P600-2FGG144 Vergleich
Detaillierter Direktvergleich von A3P250-2FGG144 von Microchip Technology und A3P600-2FGG144 von Microsemi. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P250-2FGG144 - ProASIC3 Flash FPGA 250K Gates | Microchip
A3P250-2FGG144 ✓ AktivSpezifikationsvergleich
| Parameter | A3P250-2FGG144 | A3P600-2FGG144 |
|---|---|---|
| Marke | Microchip Technology | Microsemi |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,80 | $30,40 |
| Family | ProASIC3 Flash FPGA | ProASIC3 |
| System Gates | 250K | — |
| User I/Os | 97 | — |
| Configuration Memory | 36864 (on-chip flash) | — |
| Speed Grade | -2 | -2 |
| Maximum System Performance | 310 MHz | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | — |
| Gehäuse | 144-LBGA (FBGA-144) | 144-Ball FBGA (FGG144) |
| Montagestil | SMD/SMT | — |
| Operating Temperature (Min) | 0 C | — |
| Operating Temperature (Max) | +70 C | — |
| Packaging | Tray | Tray |
| Soft ARM Support | Yes (optional, ProASIC3 family) | — |
| Configuration Type | Flash (single-chip, live at power-up) | — |
| Reprogrammability | Yes (in-system reprogrammable) | — |
| Equivalent Gate Count | — | 600000 gates |
| Logic Cells (CLBs) | — | 13824 CLBs |
| User I/O | — | 97 I/O |
| System Performance | — | 310 MHz |
| Core Voltage | — | 1.5 V |
| Program Technology | — | Nonvolatile Flash |
| Ball Pitch | — | 1 mm |
| Montageart | — | Surface Mount |
| Configuration | — | Single-chip, Instant On, no external boot device |
| I/O Banks | — | 4 (independently supplied VCCIB banks) |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |