ATSAMA5D27C-D5M-CU vs ATSAMA5D27C-D5M-CUR Vergleich
Detaillierter Direktvergleich von ATSAMA5D27C-D5M-CU von Microchip Technology und ATSAMA5D27C-D5M-CUR von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip
ATSAMA5D27C-D5M-CU ✓ AktivMicrochip Technology
ATSAMA5D27C-D5M-CUR - SAMA5D2 Cortex-A5 MPU 500MHz 512Mb DDR2 | Microchip
ATSAMA5D27C-D5M-CUR ✓ AktivSpezifikationsvergleich
| Parameter | ATSAMA5D27C-D5M-CU | ATSAMA5D27C-D5M-CUR |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,40 | $23,10 |
| Part Status | Active | — |
| Core Processor | ARM Cortex-A5 | — |
| Number of Cores / Bus Width | 1 Core, 32-Bit | — |
| Speed | 500 MHz | — |
| Co-Processors / DSP | ARM NEON, FPU | — |
| RAM Controllers | DDR2/LPDDR2 (integrated 512 Mbit DDR2 SiP) | — |
| Graphics Acceleration | Yes (2D) | — |
| Peripheral Touch Controller | Yes (16-bit databus) | Integrated |
| Audio Subsystem | I2S, class-D amplifier interface | — |
| Ethernet | Dual 10/100 GMAC with 1588 PTP | — |
| USB | USB HSIC + 2x USB 2.0 High-Speed | — |
| CAN | 2x CAN-FD | — |
| Serial Interfaces | 3x FLEXCOM (USART/SPI/TWI), 2x SD/MMC, 1x I2C, 1x SPI, 1x UART | — |
| Image Sensor Interface | Yes | — |
| Betriebstemperatur | -40°C to +85°C (Industrial) | — |
| Gehäuse / Bauform | 289-LFBGA (14x14 mm, 0.8 mm ball pitch) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Core Architecture | — | ARM Cortex-A5 |
| Number of Cores | — | 1 |
| Datenbusbreite | — | 32-bit |
| Maximale Taktfrequenz | — | 500 MHz |
| Integrated Memory | — | 512 Mbit DDR2 SDRAM (SIP) |
| Operating Voltage Range | — | 1.14 V to 1.3 V (core) |
| Memory Bus Width | — | 16-bit |
| Gehäuse | — | 289-LFBGA (14x14 mm), 0.8 mm ball pitch |
| Betriebstemperaturbereich | — | -40C to +85C (Industrial) |
| Embedded Audio Subsystem | — | Integrated |
| Security Features | — | ARM TrustZone, Secure Boot, Tamper |
| Hardware Crypto Accelerators | — | AES, SHA, TRNG |