ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip
Teilenummer: ATSAMA5D27C-D5M-CU ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $25.93 | $25,93 |
| 10 | $24.12 | $241,20 |
| 100 | $21.55 | $2.155,00 |
| 500 | $19.88 | $9.940,00 |
| 1.000 | $18.4 | $18.400,00 |
ATSAMA5D27C-D5M-CU Übersicht
An MPU is a CPU-centric integrated circuit that depends on external storage and peripherals, unlike a microcontroller (MCU) that integrates them on-die. The ATSAMA5D27C-D5M-CU sits in the hybrid System-in-Package category: it ships as a microprocessor but embeds DDR2 inside the BGA. Within the broader taxonomy, it is an application processor -> embedded microprocessor -> ARM Cortex-A SoC -> semiconductor IC. The SAMA5D2 series targets connected-embedded designs running Linux with mainline kernel support.
Key differentiating specifications include a 32-bit single-core ARM Cortex-A5 core with NEON media engine and hardware FPU, a 16-bit databus Peripheral Touch Controller (PTC), an embedded audio subsystem with I2S and class-D amplifier interface, an advanced 2D graphics accelerator, and a low-power architecture with multiple sleep modes. The 0.8 mm ball pitch simplifies escape routing on 4-layer PCBs versus finer-pitch BGA alternatives.
The architecture integrates dual Ethernet GMACs with 1588 PTP hardware timestamping, dual CAN-FD controllers, USB HSIC plus two USB 2.0 high-speed ports, three FLEXCOMs (configurable as USART/SPI/TWI), two SD/MMC interfaces, and an image sensor interface. Peripherals are routed through a multi-layer AHB/APB matrix for deterministic DMA-driven throughput. The low-leakage process supports battery-backed deployments.
Typical applications include industrial HMI panels, building automation gateways, smart energy concentrators, point-of-sale terminals, medical patient-monitoring displays, and IoT edge nodes running Linux. The integrated PTC enables robust touchscreens without an external touch controller IC.
When designing with this device, follow Microchip's SAMA5D2 hardware design checklist: respect the 0.8 mm BGA escape rules, generate a clean 1.2V core supply from a PMIC such as the MCP16502, and route any external peripherals with controlled impedance. The SiP removes external DRAM but the CPU still requires the Linux BSP and AT91Bootstrap to boot.
This page synthesizes Microchip datasheet parameters, current distributor pricing, drop-in SiP variants from the same SAMA5D2 family, and practical design notes not collated in any single manufacturer document, providing engineering-ready information for sourcing and board bring-up.
Drop-in-Alternativen für ATSAMA5D27C-D5M-CU – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMA5D27C-D5M-CU (gleiche Bauform und Footprint) – abweichend in Package, Ethernet, Operating Temperature, USB, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAMA5D27C-D1G-CU
✅ Drop-In✓ Auf Lager
$19.1 / Stück
Datenblatt ansehen →ATSAMA5D27C-D5M-CUR
✅ Drop-In✓ Auf Lager
$23.1 / Stück
Datenblatt ansehen →ATSAMA5D27C-CU
✅ Drop-In✓ Auf Lager
$11.9 / Stück
Datenblatt ansehen →ATSAMA5D28C-D1G-CU
✅ Drop-In✓ Auf Lager
$23.5 / Stück
Datenblatt ansehen →ATSAMA5D27B-CU
✅ Drop-In✓ Auf Lager
$11.85 / Stück
Datenblatt ansehen →ATSAMA5D27C-CUR
✅ Drop-In✓ Auf Lager
$12.9 / Stück
Datenblatt ansehen →ATSAMA5D27C-D5M-CU Grenzwerte & elektrische Eigenschaften
| Part Status | Active |
| Core Processor | ARM Cortex-A5 |
| Number of Cores / Bus Width | 1 Core, 32-Bit |
| Speed | 500 MHz |
| Co-Processors / DSP | ARM NEON, FPU |
| RAM Controllers | DDR2/LPDDR2 (integrated 512 Mbit DDR2 SiP) |
| Graphics Acceleration | Yes (2D) |
| Peripheral Touch Controller | Yes (16-bit databus) |
| Audio Subsystem | I2S, class-D amplifier interface |
| Ethernet | Dual 10/100 GMAC with 1588 PTP |
| USB | USB HSIC + 2x USB 2.0 High-Speed |
| CAN | 2x CAN-FD |
| Serial Interfaces | 3x FLEXCOM (USART/SPI/TWI), 2x SD/MMC, 1x I2C, 1x SPI, 1x UART |
| Image Sensor Interface | Yes |
| Betriebstemperatur | -40°C to +85°C (Industrial) |
| Gehäuse / Bauform | 289-LFBGA (14x14 mm, 0.8 mm ball pitch) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
ATSAMA5D27C-D5M-CU 289-lfbga (14x14 mm, 0.8 mm ball pitch) Pinbelegungsleitfaden
Pinbelegung für ATSAMA5D27C-D5M-CU (289-lfbga (14x14 mm, 0.8 mm ball pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ATSAMA5D27C-D5M-CU.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ATSAMA5D27C-D5M-CU ist geeignet für 7 Anwendungs: Industrial HMI Touch Panels, Building Automation Gateways, Smart Energy Concentrators, Point-of-Sale (POS) Terminals, Medical Patient-Monitoring Displays, IoT Edge Gateways with Linux, Connected Audio Appliances.
Industrial HMI Touch Panels
The ATSAMA5D27C-D5M-CU drives industrial-grade touchscreen HMIs thanks to its integrated 16-bit Peripheral Touch Controller (PTC) and 2D graphics accelerator. The Cortex-A5 core runs Linux with Qt or LVDS GUIs at 500 MHz, while the 512 Mbit integrated DDR2 SiP provides ample framebuffer memory for 800x480 and 1024x600 displays. Industrial-grade -40 to +85°C operation supports factory floor deployment.
Empfohlen
Building Automation Gateways
The ATSAMA5D27C-D5M-CU serves as a building-automation gateway controller with dual Ethernet GMACs (1588 PTP) for time-synced HVAC/lighting control, dual CAN-FD for elevator or fire-panel communication, and USB host for LoRa/Zigbee dongles. The 500 MHz Cortex-A5 with Linux runs BACnet, Modbus, and MQTT stacks concurrently. Integrated DDR2 reduces gateway BOM and PCB area versus a discrete DRAM design.
Empfohlen
Smart Energy Concentrators
The ATSAMA5D27C-D5M-CU aggregates smart-meter data over dual Ethernet, dual CAN-FD, or RS-485 (via FLEXCOM), running a Linux data concentrator stack on the Cortex-A5. The integrated 512 Mbit DDR2 holds DLMS/COSEM protocol buffers and time-series data without external memory. 1588 PTP hardware timestamping synchronizes billing-grade time across the concentrator network.
Empfohlen
Point-of-Sale (POS) Terminals
The ATSAMA5D27C-D5M-CU powers POS terminals with the 2D graphics accelerator driving the cashier display while the Cortex-A5 Linux runs payment, inventory, and printer stacks. The integrated DDR2 SiP reduces terminal height for slim counter designs, and the embedded audio subsystem drives the cashier speaker and buzzer. Industrial temperature operation suits semi-outdoor retail environments.
Empfohlen
Medical Patient-Monitoring Displays
The ATSAMA5D27C-D5M-CU drives patient-monitoring bedside displays where the 2D graphics accelerator renders real-time waveforms (ECG, SpO2, respiration) and the Cortex-A5 Linux runs the monitoring application. The 16-bit PTC supports touch input by nurses, while USB 2.0 high-speed connects to bedside peripherals. Industrial temperature grade and the integrated DDR2 SiP ensure a compact, reliable medical-grade platform.
Empfohlen
IoT Edge Gateways with Linux
The ATSAMA5D27C-D5M-CU operates as an IoT edge gateway running mainline Linux with Docker containers or Buildroot applications. The dual Ethernet GMACs segment LAN/WAN traffic, dual CAN-FD interfaces industrial sensors, and three FLEXCOMs handle RS-485, SPI, and I2C peripherals. The integrated 512 Mbit DDR2 SiP holds container images and time-series data while reducing gateway footprint.
Empfohlen
Connected Audio Appliances
The ATSAMA5D27C-D5M-CU drives connected audio products with its embedded audio subsystem (I2S, class-D amplifier interface) and Cortex-A5 core running Linux audio frameworks such as ALSA or PulseAudio. The 2D graphics accelerator drives the front-panel UI on small LCDs, while the integrated DDR2 SiP buffers audio streams for low-latency playback.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAMA5D27C-D5M-CU – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAMA5D27C-D1G-CU | ATSAMA5D27C-D5M-CUR | ATSAMA5D27C-CU | ATSAMA5D28C-D1G-CU |
|---|---|---|---|---|---|
| Package | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same | 289-LFBGA (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | |
| Integrated Memory | 512 Mbit DDR2 SiP | 1 Gbit DDR2 SiP | 512 Mbit DDR2 SiP | None (external DDR2 required) | 1 Gbit DDR2 SiP |
| Core | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz | |
| Ethernet | Dual GMAC + 1588 PTP | Dual GMAC + 1588 PTP | Dual GMAC + 1588 PTP | Dual GMAC + 1588 PTP + TrustZone | |
| Operating Temperature | -40°C to +85°C (Industrial) | -40°C to +85°C (Industrial) | -40°C to +85°C (Industrial) | -40°C to +85°C (Industrial) | |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Integrated 512 Mbit DDR2 SiP reduces BOM and PCB complexity (vs. ATSAMA5D27C-CU (without SiP memory))
- 1 Gbit DDR2 SiP option for larger memory workloads (vs. ATSAMA5D27C-D5M-CU (this product, 512 Mbit))
- Same package as siblings for pin-compatible upgrades (vs. ATSAMA5D28C-D1G-CU)
Designhinweise
Estimated: power the ATSAMA5D27C-D5M-CU via the Microchip MCP16502 PMIC, which generates the 1.2V core rail, 1.8V DDR2 rail, and 3.3V I/O rail from a single 5V or higher input. The SiP integrates DDR2 but still requires the 1.2V and 1.8V supplies to power the logic and DRAM. A clean 1.2V core rail with low ripple (<30 mV) is critical for Cortex-A5 jitter performance. Decouple each supply pin with 100 nF X7R ceramic placed as close to the BGA balls as the 0.8 mm pitch allows.
Design the PCB for the 0.8 mm BGA escape: use microvia-in-pad (VIP) on inner pads if the stackup supports it, or dog-bone fanout to a 0.5 mm via-pitch inner layer. Per Microchip's SAMA5D2 hardware design guide, route all DDR2 signals (now internal to the SiP) first but allow escape room for the high-speed USB 2.0 differential pairs, GMAC RGMII to the Ethernet PHY, and the parallel LCD RGB bus if used. Maintain 90 ohm differential impedance for USB and 50 ohm single-ended for RGMII.
Place the MCP16502 PMIC and the LAN8742A Ethernet PHY on the bottom side of the PCB directly under the ATSAMA5D27C-D5M-CU BGA to minimize loop area on the 1.2V core rail. Route the GMAC RGMII traces with matched lengths (within 50 mil) and keep the 25 MHz reference clock trace short and well-shielded. Per the SAMA5D2 hardware checklist, leave the SDRAM-via region isolated and avoid routing analog audio (I2S, class-D) traces across noisy power regions.
Estimated: under typical Linux HMI workloads at 500 MHz, the ATSAMA5D27C-D5M-CU dissipates roughly 0.5-0.8 W, depending on which peripherals are enabled. The 289-LFBGA.15 mm package has a theta-JA of approximately 25 C/W on a standard 4-layer JEDEC PCB, giving a junction-to-ambient rise of 12-20°C at industrial ambient. Thermal vias under the center ground balls reduce junction temperature in enclosed industrial enclosures.
Do not confuse the ATSAMA5D27C-D5M-CU (with SiP DDR2) for the ATSAMA5D27C-CU (without SiP DDR2) - the latter requires external DDR2 PCB routing and a different bootloader configuration. Per the Microchip SAMA5D2 datasheet, software bring-up requires AT91Bootstrap, U-Boot, and the Linux4SAM kernel; missing these steps leads to boot failures. Also verify the OTP memory configuration and disable JTAG in production builds to secure the device.
Compliance-Informationen
RoHS compliant per Microchip product page and distributor listings. Industrial temperature grade (-40°C to +85°C) but not AEC-Q100 qualified. AEC-Q100 not applicable for non-automotive MPU focus.
