BSC9131NSN1KHKB557 vs BSC9131NXE1KHKB Vergleich
Detaillierter Direktvergleich von BSC9131NSN1KHKB557 von NXP Semiconductors und BSC9131NXE1KHKB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP
BSC9131NSN1KHKB557 ✓ AktivSpezifikationsvergleich
| Parameter | BSC9131NSN1KHKB557 | BSC9131NXE1KHKB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Product Type | Embedded microprocessor | Microprocessor unit |
| Processor Family | QorIQ Qonverge BSC9131 | — |
| Core Count | 1 core | 1 core |
| Word Size | 32-bit | — |
| Maximum Operating Frequency | 800 MHz | — |
| Core Technology | Power e500 | — |
| Additional Core Technology | StarCore SC3850 | — |
| DSP Acceleration | MAPLE-B2F specialist DSP acceleration processing | — |
| Package Type | 520-FCBGA | — |
| Package Dimensions | 21 x 21 mm | — |
| Ball Count | 520 balls | — |
| Montageart | Surface mount | — |
| Primary Application | Small-cell base stations | — |
| Additional Applications | Enterprise VoIP, smart-grid control, military and defense, industrial | — |
| Device Category | Microprocessor IC, MPU and DSP | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Status | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Manufacturer | — | NXP Semiconductors |
| Processor Architecture | — | 32-bit RISC |
| Exact MPN Clock Frequency | — | 800 MHz |
| General-Purpose Core | — | Power Architecture e500 |
| DSP Core | — | StarCore SC3850 |
| Bus Width | — | 32-bit |
| Process Technology | — | 45 nm |
| Specialist Accelerator | — | MAPLE-B2F baseband acceleration processing |
| Security Accelerator | — | SEC 4.4 |
| RAM Controllers | — | DDR3 and DDR3L |
| Graphics Acceleration | — | No |
| Gehäuse | — | 520-ball FCBGA |
| Package Shape | — | Square |
| Terminal Count | — | 520 balls |
| Temperature Grade | — | Industrial |
| Betriebstemperatur | — | -40°C to +105°C |
| Shipping Package | — | Tray |
| Lebenszyklusstatus | — | End of Life |