BSC9131NSN1KHKB557 vs BSC9131NXE1KHKB Comparaison
Comparaison détaillée côte à côte de BSC9131NSN1KHKB557 par NXP Semiconductors et BSC9131NXE1KHKB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP
BSC9131NSN1KHKB557 ✓ ActifComparaison des spécifications
| Paramètre | BSC9131NSN1KHKB557 | BSC9131NXE1KHKB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Fin de vie |
| Product Type | Embedded microprocessor | Microprocessor unit |
| Processor Family | QorIQ Qonverge BSC9131 | — |
| Core Count | 1 core | 1 core |
| Word Size | 32-bit | — |
| Maximum Operating Frequency | 800 MHz | — |
| Core Technology | Power e500 | — |
| Additional Core Technology | StarCore SC3850 | — |
| DSP Acceleration | MAPLE-B2F specialist DSP acceleration processing | — |
| Package Type | 520-FCBGA | — |
| Package Dimensions | 21 x 21 mm | — |
| Ball Count | 520 balls | — |
| Type de montage | Surface mount | — |
| Primary Application | Small-cell base stations | — |
| Additional Applications | Enterprise VoIP, smart-grid control, military and defense, industrial | — |
| Device Category | Microprocessor IC, MPU and DSP | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Status | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Manufacturer | — | NXP Semiconductors |
| Processor Architecture | — | 32-bit RISC |
| Exact MPN Clock Frequency | — | 800 MHz |
| General-Purpose Core | — | Power Architecture e500 |
| DSP Core | — | StarCore SC3850 |
| Bus Width | — | 32-bit |
| Process Technology | — | 45 nm |
| Specialist Accelerator | — | MAPLE-B2F baseband acceleration processing |
| Security Accelerator | — | SEC 4.4 |
| RAM Controllers | — | DDR3 and DDR3L |
| Graphics Acceleration | — | No |
| Boîtier | — | 520-ball FCBGA |
| Package Shape | — | Square |
| Terminal Count | — | 520 balls |
| Temperature Grade | — | Industrial |
| Température de fonctionnement | — | -40°C to +105°C |
| Shipping Package | — | Tray |
| Statut du cycle de vie | — | End of Life |