BSC9131NSN1KHKB557 vs BSC9131NXE1KHKB Comparação
Comparação detalhada lado a lado de BSC9131NSN1KHKB557 por NXP Semiconductors e BSC9131NXE1KHKB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP
BSC9131NSN1KHKB557 ✓ AtivoComparação de especificações
| Parâmetro | BSC9131NSN1KHKB557 | BSC9131NXE1KHKB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Fim de vida |
| Product Type | Embedded microprocessor | Microprocessor unit |
| Processor Family | QorIQ Qonverge BSC9131 | — |
| Core Count | 1 core | 1 core |
| Word Size | 32-bit | — |
| Maximum Operating Frequency | 800 MHz | — |
| Core Technology | Power e500 | — |
| Additional Core Technology | StarCore SC3850 | — |
| DSP Acceleration | MAPLE-B2F specialist DSP acceleration processing | — |
| Package Type | 520-FCBGA | — |
| Package Dimensions | 21 x 21 mm | — |
| Ball Count | 520 balls | — |
| Tipo de montagem | Surface mount | — |
| Primary Application | Small-cell base stations | — |
| Additional Applications | Enterprise VoIP, smart-grid control, military and defense, industrial | — |
| Device Category | Microprocessor IC, MPU and DSP | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Status | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Faixa de temperatura de operação | [DATA_NEEDED: operating temperature range] | — |
| Manufacturer | — | NXP Semiconductors |
| Processor Architecture | — | 32-bit RISC |
| Exact MPN Clock Frequency | — | 800 MHz |
| General-Purpose Core | — | Power Architecture e500 |
| DSP Core | — | StarCore SC3850 |
| Bus Width | — | 32-bit |
| Process Technology | — | 45 nm |
| Specialist Accelerator | — | MAPLE-B2F baseband acceleration processing |
| Security Accelerator | — | SEC 4.4 |
| RAM Controllers | — | DDR3 and DDR3L |
| Graphics Acceleration | — | No |
| Encapsulamento | — | 520-ball FCBGA |
| Package Shape | — | Square |
| Terminal Count | — | 520 balls |
| Temperature Grade | — | Industrial |
| Temperatura de operação | — | -40°C to +105°C |
| Shipping Package | — | Tray |
| Status do ciclo de vida | — | End of Life |