BSC9131NSN1KHKB557 vs BSC9131NXE1KHKB Perbandingan
Perbandingan bersamaan detil BSC9131NSN1KHKB557 dari NXP Semiconductors dan BSC9131NXE1KHKB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP
BSC9131NSN1KHKB557 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | BSC9131NSN1KHKB557 | BSC9131NXE1KHKB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Product Type | Embedded microprocessor | Microprocessor unit |
| Processor Family | QorIQ Qonverge BSC9131 | — |
| Core Count | 1 core | 1 core |
| Word Size | 32-bit | — |
| Maximum Operating Frequency | 800 MHz | — |
| Core Technology | Power e500 | — |
| Additional Core Technology | StarCore SC3850 | — |
| DSP Acceleration | MAPLE-B2F specialist DSP acceleration processing | — |
| Package Type | 520-FCBGA | — |
| Package Dimensions | 21 x 21 mm | — |
| Ball Count | 520 balls | — |
| Tipe Mounting | Surface mount | — |
| Primary Application | Small-cell base stations | — |
| Additional Applications | Enterprise VoIP, smart-grid control, military and defense, industrial | — |
| Device Category | Microprocessor IC, MPU and DSP | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Status | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Rentang Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Manufacturer | — | NXP Semiconductors |
| Processor Architecture | — | 32-bit RISC |
| Exact MPN Clock Frequency | — | 800 MHz |
| General-Purpose Core | — | Power Architecture e500 |
| DSP Core | — | StarCore SC3850 |
| Bus Width | — | 32-bit |
| Process Technology | — | 45 nm |
| Specialist Accelerator | — | MAPLE-B2F baseband acceleration processing |
| Security Accelerator | — | SEC 4.4 |
| RAM Controllers | — | DDR3 and DDR3L |
| Graphics Acceleration | — | No |
| Paket | — | 520-ball FCBGA |
| Package Shape | — | Square |
| Terminal Count | — | 520 balls |
| Temperature Grade | — | Industrial |
| Suhu Kerja | — | -40°C to +105°C |
| Shipping Package | — | Tray |
| Status Lingkungan Hidup | — | End of Life |