DSP56301VF100 vs DSP56311VF150 Vergleich
Detaillierter Direktvergleich von DSP56301VF100 von NXP Semiconductors und DSP56311VF150 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
DSP56301VF100 - 100MHz 24-bit Fixed-Point DSP, 252-MAPBGA | NXP
DSP56301VF100 Obsolete
Spezifikationsvergleich
| Parameter | DSP56301VF100 | DSP56311VF150 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16,95 | $24,90 |
| Type | Fixed-Point Digital Signal Processor | Fixed-Point Digital Signal Processor |
| Family | DSP56300 (DSP563XX series) | — |
| Core Clock Speed | 100 MHz | — |
| Instruction Throughput | 100 MIPS / 100 MMACS | 150 MIPS |
| Data Word Width | 24 bits (parallel X and Y data paths) | — |
| On-Chip RAM | 24 kB | 384 KB |
| On-Chip ROM (Non-Volatile) | 9 kB | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Host Interface | Yes | — |
| Serial Interfaces | SSI (Synchronous Serial Interface), SCI (Serial Communication Interface) | Host Interface (HI), SSI, SCI |
| Timers | Triple Timer block | — |
| Gehäuse / Bauform | 252-MAPBGA (21 x 21 mm) | — |
| Packaging | Tray | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | DSP56300 (Symphony) |
| Core Clock Frequency | — | 150 MHz |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Datenbusbreite | — | 24 bit |
| Bootstrap ROM | — | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| DMA Channels | — | 6 |
| Input Logic Compatibility | — | TTL-compatible |
| Gehäuse | — | 196-ball MAP-BGA (15x15 mm) |
| Process Technology | — | High-density CMOS |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |