DSP56301VF100 vs DSP56311VF150 Comparaison
Comparaison détaillée côte à côte de DSP56301VF100 par NXP Semiconductors et DSP56311VF150 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
DSP56301VF100 - 100MHz 24-bit Fixed-Point DSP, 252-MAPBGA | NXP
DSP56301VF100 Obsolete
Comparaison des spécifications
| Paramètre | DSP56301VF100 | DSP56311VF150 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $16,95 | $24,90 |
| Type | Fixed-Point Digital Signal Processor | Fixed-Point Digital Signal Processor |
| Family | DSP56300 (DSP563XX series) | — |
| Core Clock Speed | 100 MHz | — |
| Instruction Throughput | 100 MIPS / 100 MMACS | 150 MIPS |
| Data Word Width | 24 bits (parallel X and Y data paths) | — |
| On-Chip RAM | 24 kB | 384 KB |
| On-Chip ROM (Non-Volatile) | 9 kB | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Host Interface | Yes | — |
| Serial Interfaces | SSI (Synchronous Serial Interface), SCI (Serial Communication Interface) | Host Interface (HI), SSI, SCI |
| Timers | Triple Timer block | — |
| Boîtier / Format | 252-MAPBGA (21 x 21 mm) | — |
| Packaging | Tray | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | DSP56300 (Symphony) |
| Core Clock Frequency | — | 150 MHz |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Largeur du bus de données | — | 24 bit |
| Bootstrap ROM | — | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| DMA Channels | — | 6 |
| Input Logic Compatibility | — | TTL-compatible |
| Boîtier | — | 196-ball MAP-BGA (15x15 mm) |
| Process Technology | — | High-density CMOS |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |