DSP56301VF100 vs DSP56311VF150 Comparação
Comparação detalhada lado a lado de DSP56301VF100 por NXP Semiconductors e DSP56311VF150 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
DSP56301VF100 - 100MHz 24-bit Fixed-Point DSP, 252-MAPBGA | NXP
DSP56301VF100 Obsolete
Comparação de especificações
| Parâmetro | DSP56301VF100 | DSP56311VF150 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | DSP | DSP |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $16,95 | $24,90 |
| Type | Fixed-Point Digital Signal Processor | Fixed-Point Digital Signal Processor |
| Family | DSP56300 (DSP563XX series) | — |
| Core Clock Speed | 100 MHz | — |
| Instruction Throughput | 100 MIPS / 100 MMACS | 150 MIPS |
| Data Word Width | 24 bits (parallel X and Y data paths) | — |
| On-Chip RAM | 24 kB | 384 KB |
| On-Chip ROM (Non-Volatile) | 9 kB | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Host Interface | Yes | — |
| Serial Interfaces | SSI (Synchronous Serial Interface), SCI (Serial Communication Interface) | Host Interface (HI), SSI, SCI |
| Timers | Triple Timer block | — |
| Encapsulamento / Caixa | 252-MAPBGA (21 x 21 mm) | — |
| Packaging | Tray | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | DSP56300 (Symphony) |
| Core Clock Frequency | — | 150 MHz |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Largura do barramento de dados | — | 24 bit |
| Bootstrap ROM | — | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| DMA Channels | — | 6 |
| Input Logic Compatibility | — | TTL-compatible |
| Encapsulamento | — | 196-ball MAP-BGA (15x15 mm) |
| Process Technology | — | High-density CMOS |
| Nível MSL | — | [DATA_NEEDED: MSL rating] |