DSP56301VF100 vs DSP56311VF150 Comparación
Comparación detallada lado a lado de DSP56301VF100 por NXP Semiconductors y DSP56311VF150 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
DSP56301VF100 - 100MHz 24-bit Fixed-Point DSP, 252-MAPBGA | NXP
DSP56301VF100 Obsolete
Comparación de especificaciones
| Parámetro | DSP56301VF100 | DSP56311VF150 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,95 | $24,90 |
| Type | Fixed-Point Digital Signal Processor | Fixed-Point Digital Signal Processor |
| Family | DSP56300 (DSP563XX series) | — |
| Core Clock Speed | 100 MHz | — |
| Instruction Throughput | 100 MIPS / 100 MMACS | 150 MIPS |
| Data Word Width | 24 bits (parallel X and Y data paths) | — |
| On-Chip RAM | 24 kB | 384 KB |
| On-Chip ROM (Non-Volatile) | 9 kB | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Host Interface | Yes | — |
| Serial Interfaces | SSI (Synchronous Serial Interface), SCI (Serial Communication Interface) | Host Interface (HI), SSI, SCI |
| Timers | Triple Timer block | — |
| Encapsulado / Carcasa | 252-MAPBGA (21 x 21 mm) | — |
| Packaging | Tray | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | DSP56300 (Symphony) |
| Core Clock Frequency | — | 150 MHz |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Ancho del bus de datos | — | 24 bit |
| Bootstrap ROM | — | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| DMA Channels | — | 6 |
| Input Logic Compatibility | — | TTL-compatible |
| Encapsulado | — | 196-ball MAP-BGA (15x15 mm) |
| Process Technology | — | High-density CMOS |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |