DSP56303VF100 vs DSP56303AG100 Vergleich
Detaillierter Direktvergleich von DSP56303VF100 von NXP Semiconductors und DSP56303AG100 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors
DSP56303AG100 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | DSP56303VF100 | DSP56303AG100 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $30,10 | $18,90 |
| Core Architecture | DSP56300 family, 24-bit fixed-point | DSP56300 family, 24-bit fixed-point |
| Clock Frequency | 100 MHz | — |
| Performance | 100 MIPS (million instructions per second) | — |
| Instruction Cycle | Single clock cycle per instruction | — |
| Data Word Width | 24 bits | 24-bit (56-bit accumulator) |
| Address Space | 24-bit program and data | — |
| On-Chip RAM | 24 KB | — |
| Bootstrap ROM | 576 bytes | — |
| Gehäuse | 196-ball LBGA (15x15 mm), MAP-BGA-196 | 144-LQFP (Low-profile Fine-pitch QFP), 20x20 mm |
| I/O Voltage | 3.30 V | 3.3 V |
| Core Voltage | [DATA_NEEDED: internal core Vdd] | 1.8 V |
| Interfaces | Host Interface (HI08), ESSI, SCI | — |
| On-Chip Peripherals | Triple Timer, PLL, External Memory Expansion port | — |
| Debug | JTAG/OnCE | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Betriebstemperatur | [DATA_NEEDED: industrial temperature grade] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance per datasheet] | [DATA_NEEDED: RoHS status] |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Instruction Word Width | — | 24-bit |
| Operating Frequency | — | 100 MHz (100 MIPS) |
| On-Chip Program/Data RAM | — | 24 KB |
| On-Chip X/Y Data RAM | — | 24 KB |
| Boot ROM | — | 576 bytes |
| External Memory Bus | — | 24-bit address / 24-bit data, 16-bit external data bus expansion |
| Serial Interfaces | — | 2x ESSI, 1x SCI, 1x HI08 (Host) |
| Timers | — | Triple Timer module (3x 16-bit) |
| Address Generation | — | 24-bit ALU with bit-reversed addressing for FFT |
| Betriebstemperaturbereich | — | -40C to +85C (industrial) |