DSP56303VF100 vs DSP56303AG100 Comparação

Comparação detalhada lado a lado de DSP56303VF100 por NXP Semiconductors e DSP56303AG100 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
DSP56303VF100 DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 - 24-Bit 100MHz/100MIPS DSP | NXP | BGA-196

DSP56303VF100 Obsolete
NXP Semiconductors
DSP56303AG100 DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors

DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors

DSP56303AG100 ✗ Fim de vida

Comparação de especificações

Parâmetro DSP56303VF100 DSP56303AG100
Marca NXP Semiconductors NXP Semiconductors
Categoria DSP DSP
Status do ciclo de vida Obsolete Fim de vida
Status do estoque In Stock In Stock
Preço unitário (USD) $30,10 $18,90
Core Architecture DSP56300 family, 24-bit fixed-point DSP56300 family, 24-bit fixed-point
Clock Frequency 100 MHz —
Performance 100 MIPS (million instructions per second) —
Instruction Cycle Single clock cycle per instruction —
Data Word Width 24 bits 24-bit (56-bit accumulator)
Address Space 24-bit program and data —
On-Chip RAM 24 KB —
Bootstrap ROM 576 bytes —
Encapsulamento 196-ball LBGA (15x15 mm), MAP-BGA-196 144-LQFP (Low-profile Fine-pitch QFP), 20x20 mm
I/O Voltage 3.30 V 3.3 V
Core Voltage [DATA_NEEDED: internal core Vdd] 1.8 V
Interfaces Host Interface (HI08), ESSI, SCI —
On-Chip Peripherals Triple Timer, PLL, External Memory Expansion port —
Debug JTAG/OnCE —
Tipo de montagem Surface Mount Surface Mount
Packaging Tray —
Temperatura de operação [DATA_NEEDED: industrial temperature grade] —
Status RoHS [DATA_NEEDED: RoHS compliance per datasheet] [DATA_NEEDED: RoHS status]
Nível MSL [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: MSL level]
Instruction Word Width — 24-bit
Operating Frequency — 100 MHz (100 MIPS)
On-Chip Program/Data RAM — 24 KB
On-Chip X/Y Data RAM — 24 KB
Boot ROM — 576 bytes
External Memory Bus — 24-bit address / 24-bit data, 16-bit external data bus expansion
Serial Interfaces — 2x ESSI, 1x SCI, 1x HI08 (Host)
Timers — Triple Timer module (3x 16-bit)
Address Generation — 24-bit ALU with bit-reversed addressing for FFT
Faixa de temperatura de operação — -40C to +85C (industrial)

Fichas técnicas e recursos

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