EP1M120B484C6 vs EP1M120F484C6 Vergleich

Detaillierter Direktvergleich von EP1M120B484C6 von Intel und EP1M120F484C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1M120B484C6 EP1M120F484C6
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $55,00 $198,00
Family Mercury (ACEX 1M) Mercury (APEX EP1M)
Logic Elements (typical) 120 LE —
Maximum Logic Elements [DATA_NEEDED: maximum logic elements] —
Flip-Flops 4,800 —
User I/O Pins (max) 303 —
Configuration Memory SRAM-based (volatile, re-load on power-up) —
Gehäuse 484-ball FineLine BGA (BGA-484) 484-ball FC-FBGA (FineLine BGA)
Montageart Surface Mount Surface Mount (BGA)
Peak Reflow Temperature 220 °C —
Operating Temperature Grade Commercial (C suffix) —
Process Node 0.18 µm —
JTAG Support IEEE 1149.1 boundary-scan —
Configuration Modes PS, AS, JTAG —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Design Software Quartus II (legacy support required) —
Typical Gates — 120,000
Logic Cells — 4,800
Logic Elements (LEs) — 49,152 (per distributor listing)
User I/O — 303
Logic Array Blocks (LABs) — 480
Ball Pitch — [DATA_NEEDED: ball pitch]
Core Supply Voltage — 1.8 V
Logic Family — CMOS
Betriebstemperatur — 0 C to +85 C (Commercial)
Integrated Transceivers — High-speed CDR to 1.25 Gbps
Embedded System Blocks (ESBs) — Yes (dual-port RAM / ROM / CAM)
Process Technology — [DATA_NEEDED: process node]

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