EP1M120B484C6 vs EP1M120F484C6 Comparison

Detailed side-by-side comparison of EP1M120B484C6 by Intel and EP1M120F484C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1M120B484C6 EP1M120F484C6
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $55.00 $198.00
Family Mercury (ACEX 1M) Mercury (APEX EP1M)
Logic Elements (typical) 120 LE β€”
Maximum Logic Elements [DATA_NEEDED: maximum logic elements] β€”
Flip-Flops 4,800 β€”
User I/O Pins (max) 303 β€”
Configuration Memory SRAM-based (volatile, re-load on power-up) β€”
Package 484-ball FineLine BGA (BGA-484) 484-ball FC-FBGA (FineLine BGA)
Mounting Type Surface Mount Surface Mount (BGA)
Peak Reflow Temperature 220 Β°C β€”
Operating Temperature Grade Commercial (C suffix) β€”
Process Node 0.18 Β΅m β€”
JTAG Support IEEE 1149.1 boundary-scan β€”
Configuration Modes PS, AS, JTAG β€”
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Design Software Quartus II (legacy support required) β€”
Typical Gates β€” 120,000
Logic Cells β€” 4,800
Logic Elements (LEs) β€” 49,152 (per distributor listing)
User I/O β€” 303
Logic Array Blocks (LABs) β€” 480
Ball Pitch β€” [DATA_NEEDED: ball pitch]
Core Supply Voltage β€” 1.8 V
Logic Family β€” CMOS
Operating Temperature β€” 0 C to +85 C (Commercial)
Integrated Transceivers β€” High-speed CDR to 1.25 Gbps
Embedded System Blocks (ESBs) β€” Yes (dual-port RAM / ROM / CAM)
Process Technology β€” [DATA_NEEDED: process node]

Datasheets & Resources

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