EP1SGX25DF800C6N vs EP1SGX25DF800I6N Vergleich
Detaillierter Direktvergleich von EP1SGX25DF800C6N von Intel und EP1SGX25DF800I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1SGX25DF800C6N - Stratix GX FPGA, 25K LE, 3.1875 Gbps SERDES | Intel / Altera
EP1SGX25DF800C6N ObsoleteIntel
EP1SGX25DF800I6N - Stratix GX FPGA, 25K LE, 20x 3.1875 Gbps Transceivers | Intel / Altera
EP1SGX25DF800I6N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP1SGX25DF800C6N | EP1SGX25DF800I6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $118,00 | $1.450,00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,560 LEs | [DATA_NEEDED: logic element count] |
| Maximum Transceiver Channels | 20 channels | — |
| Maximum Transceiver Data Rate | 3.1875 Gbps | 3.1875 Gbps per channel |
| Gehäuse | FBGA-780 (FineLine BGA, 800-ball per JEDEC ordering code) | 800-pin FineLine BGA (DF800) |
| Process Node | [DATA_NEEDED: process node] | — |
| Core Voltage | 1.5 V | — |
| Betriebstemperatur | Commercial (0 C to +85 C) | — |
| Speed Grade | 6 | -6 (production grade) |
| Configuration Method | Passive Serial / Passive Parallel / Active Serial / JTAG | — |
| Transceiver Encoding | 8B/10B | — |
| Clock Data Recovery (CDR) | Yes, integrated per channel | — |
| Speichertyp | TriMatrix embedded SRAM | — |
| DSP Blocks | Yes, embedded multiplier blocks | Up to 22 DSP blocks |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead Free | [DATA_NEEDED: lead free status] | — |
| Transceiver Channels | — | 4 to 20 channels |
| CDR / SERDES | — | Embedded clock-data recovery and SERDES |
| Memory | — | TriMatrix memory, up to 2 Mbits |
| Hard IP | — | PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II) |
| Source-Synchronous Channels | — | 8 channels |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Temperature Range | — | Industrial -40C to +100C |
| Protocol Support | — | Gigabit Ethernet, SONET/SDH, PCI Express, custom serial |