EP1SGX25DF800C6N vs EP1SGX25DF800I6N Comparison

Detailed side-by-side comparison of EP1SGX25DF800C6N by Intel and EP1SGX25DF800I6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25DF800C6N EP1SGX25DF800I6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $118.00 $1,450.00
Family Stratix GX Stratix GX
Logic Elements 25,560 LEs [DATA_NEEDED: logic element count]
Maximum Transceiver Channels 20 channels β€”
Maximum Transceiver Data Rate 3.1875 Gbps 3.1875 Gbps per channel
Package FBGA-780 (FineLine BGA, 800-ball per JEDEC ordering code) 800-pin FineLine BGA (DF800)
Process Node [DATA_NEEDED: process node] β€”
Core Voltage 1.5 V β€”
Operating Temperature Commercial (0 C to +85 C) β€”
Speed Grade 6 -6 (production grade)
Configuration Method Passive Serial / Passive Parallel / Active Serial / JTAG β€”
Transceiver Encoding 8B/10B β€”
Clock Data Recovery (CDR) Yes, integrated per channel β€”
Memory Type TriMatrix embedded SRAM β€”
DSP Blocks Yes, embedded multiplier blocks Up to 22 DSP blocks
Mounting Type Surface Mount (BGA) β€”
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Lead Free [DATA_NEEDED: lead free status] β€”
Transceiver Channels β€” 4 to 20 channels
CDR / SERDES β€” Embedded clock-data recovery and SERDES
Memory β€” TriMatrix memory, up to 2 Mbits
Hard IP β€” PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II)
Source-Synchronous Channels β€” 8 channels
I/O Standards β€” LVDS, LVTTL, LVCMOS, SSTL, HSTL
Temperature Range β€” Industrial -40C to +100C
Protocol Support β€” Gigabit Ethernet, SONET/SDH, PCI Express, custom serial

Datasheets & Resources

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