EP20K400FC784-3 vs EP20K400FI784-3 Vergleich
Detaillierter Direktvergleich von EP20K400FC784-3 von Intel und EP20K400FI784-3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K400FC784-3 | EP20K400FI784-3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $175,00 | $155,00 |
| Family | APEX 20K (MultiCore) | APEX 20K |
| Typical Gates | 400,000 | — |
| Maximum System Gates | 1,052,000 | — |
| Logic Elements | 21,168 | [DATA_NEEDED: exact LE count] |
| Maximum RAM Bits | 212,992 | — |
| Embedded System Blocks (ESBs) | 100 | [DATA_NEEDED: ESB count] |
| PLLs | 4 | — |
| User I/O Pins | 488 | — |
| Gehäuse | 784-ball FineLine BGA (FC) | 784-ball PBGA (Fine-pitch BGA) |
| Speed Grade | -3 | -3 (slowest) |
| Betriebstemperatur | Commercial (0°C to +85°C) | -40 °C to +100 °C (industrial) |
| I/O Standards | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS SRAM |
| Configuration Method | Serial or parallel, SRAM-based | SRAM (external EPROM required) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| MSL-Level | [DATA_NEEDED: MSL rating] | 3 |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Typical Gate Count | — | 400,000 gates |
| Dedicated Inputs | — | 4 |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count] |
| Supply Voltage (Nominal) | — | 2.5 V |
| Supply Voltage Range | — | 2.375 V to 2.625 V |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Terminal Pitch | — | 1.000 mm |
| Seated Height (max) | — | 2.7000 mm |
| Body Material | — | Plastic / Epoxy |
| Montageart | — | Surface Mount |