EP20K400FC784-3 vs EP20K400FI784-3 对比
详细并排对比 EP20K400FC784-3 出自 Intel 和 EP20K400FI784-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP20K400FC784-3 | EP20K400FI784-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $175.00 | $155.00 |
| Family | APEX 20K (MultiCore) | APEX 20K |
| Typical Gates | 400,000 | — |
| Maximum System Gates | 1,052,000 | — |
| Logic Elements | 21,168 | [DATA_NEEDED: exact LE count] |
| Maximum RAM Bits | 212,992 | — |
| Embedded System Blocks (ESBs) | 100 | [DATA_NEEDED: ESB count] |
| PLLs | 4 | — |
| User I/O Pins | 488 | — |
| 封装 | 784-ball FineLine BGA (FC) | 784-ball PBGA (Fine-pitch BGA) |
| Speed Grade | -3 | -3 (slowest) |
| 工作温度 | Commercial (0°C to +85°C) | -40 °C to +100 °C (industrial) |
| I/O Standards | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS SRAM |
| Configuration Method | Serial or parallel, SRAM-based | SRAM (external EPROM required) |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| MSL 等级 | [DATA_NEEDED: MSL rating] | 3 |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Typical Gate Count | — | 400,000 gates |
| Dedicated Inputs | — | 4 |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count] |
| Supply Voltage (Nominal) | — | 2.5 V |
| Supply Voltage Range | — | 2.375 V to 2.625 V |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Terminal Pitch | — | 1.000 mm |
| Seated Height (max) | — | 2.7000 mm |
| Body Material | — | Plastic / Epoxy |
| 安装类型 | — | Surface Mount |