EP20K400FC784-3 vs EP20K400FI784-3 Comparaison
Comparaison détaillée côte à côte de EP20K400FC784-3 par Intel et EP20K400FI784-3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K400FC784-3 | EP20K400FI784-3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $175,00 | $155,00 |
| Family | APEX 20K (MultiCore) | APEX 20K |
| Typical Gates | 400,000 | — |
| Maximum System Gates | 1,052,000 | — |
| Logic Elements | 21,168 | [DATA_NEEDED: exact LE count] |
| Maximum RAM Bits | 212,992 | — |
| Embedded System Blocks (ESBs) | 100 | [DATA_NEEDED: ESB count] |
| PLLs | 4 | — |
| User I/O Pins | 488 | — |
| Boîtier | 784-ball FineLine BGA (FC) | 784-ball PBGA (Fine-pitch BGA) |
| Speed Grade | -3 | -3 (slowest) |
| Température de fonctionnement | Commercial (0°C to +85°C) | -40 °C to +100 °C (industrial) |
| I/O Standards | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS SRAM |
| Configuration Method | Serial or parallel, SRAM-based | SRAM (external EPROM required) |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Niveau MSL | [DATA_NEEDED: MSL rating] | 3 |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Typical Gate Count | — | 400,000 gates |
| Dedicated Inputs | — | 4 |
| Maximum User I/O | — | [DATA_NEEDED: user I/O count] |
| Supply Voltage (Nominal) | — | 2.5 V |
| Supply Voltage Range | — | 2.375 V to 2.625 V |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Terminal Pitch | — | 1.000 mm |
| Seated Height (max) | — | 2.7000 mm |
| Body Material | — | Plastic / Epoxy |
| Type de montage | — | Surface Mount |