EP2A15B652C9 vs EP2A25B652C9 Vergleich
Detaillierter Direktvergleich von EP2A15B652C9 von Intel und EP2A25B652C9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A15B652C9 | EP2A25B652C9 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $105,00 |
| Family | APEX II | — |
| Logic Elements | 15,600 | 24,320 |
| Embedded System Blocks | 425 Kbits | — |
| Number of DLLs/PLLs | 4 PLUs | — |
| Core Voltage | 1.5 V | — |
| I/O Voltage Standards | 1.5 V, 1.8 V, 2.5 V, 3.3 V (LVTTL, LVCMOS, LVDS, SSTL, HSTL) | LVTTL, LVCMOS, SSTL, LVDS |
| Speed Grade | -9 (fastest APEX II commercial) | C9 (-7 commercial) |
| Betriebstemperatur | 0 C to +85 C (commercial) | — |
| Gehäuse | 652-ball FineLine BGA | 652-ball FineLine BGA |
| Configuration Method | SRAM-based, JTAG 1149.1 boundary scan | — |
| Programming File Format | .pof / .sof (Quartus) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | 3 (168 hours) | [DATA_NEEDED: moisture sensitivity level] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Lebenszyklusstatus | Obsolete - new design not recommended | — |
| Device Family | — | APEX II (EP2A25) |
| Process Technology | — | 0.18 µm CMOS |
| Betriebstemperaturbereich | — | [DATA_NEEDED: commercial/industrial temperature range] |
| Core Voltage (VCCINT) | — | 1.8 V |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive serial, MAX configuration scheme |
| Embedded Memory | — | Embedded array blocks (EABs) |
| Embedded Multipliers | — | Yes (DSP blocks) |
| Maximum User I/O | — | [DATA_NEEDED: maximum usable I/O count for 652 BGA] |