EP2A25F672C9N vs EP2A25F672C8N Vergleich

Detaillierter Direktvergleich von EP2A25F672C9N von Intel und EP2A25F672C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A25F672C9N EP2A25F672C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $195,00 $205,00
Family APEX II APEX II
Logic Elements / Cells 24320 24,320
System Gates Approx. 900000 900,000
Maximum User I/O 492 —
Operating Frequency 236 MHz —
Core Supply Voltage (VCCINT) 1.425 V to 1.575 V (nominal 1.5 V) —
Process Technology 0.15 µm all-layer copper, up to 8 metal layers —
Gehäuse 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch 672-ball FC-FBGA (FineLine BGA)
Montageart Surface Mount (BGA) Surface Mount
Seated Height (max) 2.100 mm —
Propagation Delay 2.23 ns 1.69 ns
Logic Family CMOS —
Betriebstemperatur 0 °C to +85 °C (commercial, C9 grade) 0 C to 85 C (commercial)
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport —
LVDS Data Rate Up to 1 Gbps (True-LVDS) —
Configuration Interface Serial / Parallel PROM, JTAG, passive parallel (enhanced) —
Embedded Memory Enhanced System Blocks (ESBs) for dual-port RAM —
Design Software Quartus II (v5.1 or later) —
RoHS-Status Compliant (per distributor listings) Compliant
Technology Node — 0.15 um all-layer copper process
Maximum Internal Frequency — 333 MHz
User I/Os — 492
Package Body Size — 27 x 27 mm
Ball Pitch — 1.0 mm
Core Supply Voltage — 1.5 V
Speed Grade — C8
Multi-Gigabit Transceiver Rate — Up to 1 Gbps per channel
Lead-Free Suffix — N (lead-free, Pb-free finish)

Datenblätter & Ressourcen

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