EP2A25F672C9N vs EP2A25F672C8N Comparison

Detailed side-by-side comparison of EP2A25F672C9N by Intel and EP2A25F672C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A25F672C9N EP2A25F672C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $195.00 $205.00
Family APEX II APEX II
Logic Elements / Cells 24320 24,320
System Gates Approx. 900000 900,000
Maximum User I/O 492 β€”
Operating Frequency 236 MHz β€”
Core Supply Voltage (VCCINT) 1.425 V to 1.575 V (nominal 1.5 V) β€”
Process Technology 0.15 Β΅m all-layer copper, up to 8 metal layers β€”
Package 672-ball FineLine BGA (F672), 27 Γ— 27 mm, 1.00 mm pitch 672-ball FC-FBGA (FineLine BGA)
Mounting Type Surface Mount (BGA) Surface Mount
Seated Height (max) 2.100 mm β€”
Propagation Delay 2.23 ns 1.69 ns
Logic Family CMOS β€”
Operating Temperature 0 Β°C to +85 Β°C (commercial, C9 grade) 0 C to 85 C (commercial)
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport β€”
LVDS Data Rate Up to 1 Gbps (True-LVDS) β€”
Configuration Interface Serial / Parallel PROM, JTAG, passive parallel (enhanced) β€”
Embedded Memory Enhanced System Blocks (ESBs) for dual-port RAM β€”
Design Software Quartus II (v5.1 or later) β€”
RoHS Status Compliant (per distributor listings) Compliant
Technology Node β€” 0.15 um all-layer copper process
Maximum Internal Frequency β€” 333 MHz
User I/Os β€” 492
Package Body Size β€” 27 x 27 mm
Ball Pitch β€” 1.0 mm
Core Supply Voltage β€” 1.5 V
Speed Grade β€” C8
Multi-Gigabit Transceiver Rate β€” Up to 1 Gbps per channel
Lead-Free Suffix β€” N (lead-free, Pb-free finish)

Datasheets & Resources

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