EP2A25F672I6 vs EP2A25F672C8N Vergleich

Detaillierter Direktvergleich von EP2A25F672I6 von Intel und EP2A25F672C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A25F672I6 EP2A25F672C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $178,00 $205,00
Family APEX II APEX II
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS —
Gehäuse 672-ball FineLine BGA (FBGA-672) 672-ball FC-FBGA (FineLine BGA)
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 C8
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM —
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] Compliant
Lead-Free [DATA_NEEDED: lead-free status] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Montageart Surface Mount (BGA) Surface Mount
Technology Node — 0.15 um all-layer copper process
System Gates — 900,000
Logic Elements / Cells — 24,320
Maximum Internal Frequency — 333 MHz
Propagation Delay — 1.69 ns
User I/Os — 492
Package Body Size — 27 x 27 mm
Ball Pitch — 1.0 mm
Core Supply Voltage — 1.5 V
Betriebstemperatur — 0 C to 85 C (commercial)
Multi-Gigabit Transceiver Rate — Up to 1 Gbps per channel
Lead-Free Suffix — N (lead-free, Pb-free finish)

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