EP2A25F672I6 vs EP2A25F672C8N 对比
详细并排对比 EP2A25F672I6 出自 Intel 和 EP2A25F672C8N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2A25F672I6 | EP2A25F672C8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $178.00 | $205.00 |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | — |
| 封装 | 672-ball FineLine BGA (FBGA-672) | 672-ball FC-FBGA (FineLine BGA) |
| Core Voltage | 1.5 V | — |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | C8 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | — |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| MSL 等级 | [DATA_NEEDED: moisture sensitivity level] | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Technology Node | — | 0.15 um all-layer copper process |
| System Gates | — | 900,000 |
| Logic Elements / Cells | — | 24,320 |
| Maximum Internal Frequency | — | 333 MHz |
| Propagation Delay | — | 1.69 ns |
| User I/Os | — | 492 |
| Package Body Size | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Core Supply Voltage | — | 1.5 V |
| 工作温度 | — | 0 C to 85 C (commercial) |
| Multi-Gigabit Transceiver Rate | — | Up to 1 Gbps per channel |
| Lead-Free Suffix | — | N (lead-free, Pb-free finish) |