EP2A40F33C-9 vs EP2A40F33I-7 Vergleich

Detaillierter Direktvergleich von EP2A40F33C-9 von Intel und EP2A40F33I-7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A40F33C-9 EP2A40F33I-7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $78,00 $119,00
Family APEX II —
Maximum System Gates 1,600,000 —
Embedded RAM 65 Kbytes (approximately 540 Kbits depending on configuration) —
Gehäuse 672-ball FineLine BGA (F33), 1.27 mm pitch —
Speed Grade -9 —
Betriebstemperatur 0C to +85C (commercial) —
Process Technology 0.15 micrometer CMOS Altera APEX II CMOS programmable logic
PLLs 4 —
LVDS Channels 16 high-speed LVDS channels —
Logic Elements [DATA_NEEDED: exact LE count] [DATA_NEEDED: logic element count]
Maximum User I/O [DATA_NEEDED: max user I/O count] —
Multi-Core Architecture MegaLAB structure with embedded memory and CAM —
Configuration Method JTAG, serial PROM, parallel flash JTAG / serial configuration flash
MSL-Level 3 —
Peak Reflow Temperature 220 C 220 C (Pb-free profile)
RoHS-Status [DATA_NEEDED: not stated in provided data] [DATA_NEEDED: RoHS compliance per PCN]
Core Voltage [DATA_NEEDED: nominal core voltage] —
Montageart Surface Mount (BGA) Surface Mount
Device Family — APEX II (EP2A)
Device Member — EP2A40 (high-density)
Package Type — Fine-pitch BGA (FBGA)
Package Pin/Ball Count — 33 balls
Pitch — [DATA_NEEDED: ball pitch]
Operating Temperature Grade — Industrial (-40 C to +85 C)
Feuchtigkeitsempfindlichkeitsgrad (MSL) — 3 (per JEDEC J-STD-020)
Floor Life at MSL3 — 168 hours (factory conditions < 30 C / 60% RH)
Design Tool — Altera Quartus
Lead-Free Reflow Compatible — Yes (peak 220 C)
Voltage Supply — [DATA_NEEDED: VCCINT / VCCIO]

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