EP2A40F33C-9 vs EP2A40F33I-7 Comparación

Comparación detallada lado a lado de EP2A40F33C-9 por Intel y EP2A40F33I-7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Comparación de especificaciones

Parámetro EP2A40F33C-9 EP2A40F33I-7
Marca Intel Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida NRND Obsolete
Estado del stock In Stock In Stock
Precio unitario (USD) $78,00 $119,00
Family APEX II —
Maximum System Gates 1,600,000 —
Embedded RAM 65 Kbytes (approximately 540 Kbits depending on configuration) —
Encapsulado 672-ball FineLine BGA (F33), 1.27 mm pitch —
Speed Grade -9 —
Temperatura de funcionamiento 0C to +85C (commercial) —
Process Technology 0.15 micrometer CMOS Altera APEX II CMOS programmable logic
PLLs 4 —
LVDS Channels 16 high-speed LVDS channels —
Logic Elements [DATA_NEEDED: exact LE count] [DATA_NEEDED: logic element count]
Maximum User I/O [DATA_NEEDED: max user I/O count] —
Multi-Core Architecture MegaLAB structure with embedded memory and CAM —
Configuration Method JTAG, serial PROM, parallel flash JTAG / serial configuration flash
Nivel MSL 3 —
Peak Reflow Temperature 220 C 220 C (Pb-free profile)
Estado RoHS [DATA_NEEDED: not stated in provided data] [DATA_NEEDED: RoHS compliance per PCN]
Core Voltage [DATA_NEEDED: nominal core voltage] —
Tipo de montaje Surface Mount (BGA) Surface Mount
Device Family — APEX II (EP2A)
Device Member — EP2A40 (high-density)
Package Type — Fine-pitch BGA (FBGA)
Package Pin/Ball Count — 33 balls
Pitch — [DATA_NEEDED: ball pitch]
Operating Temperature Grade — Industrial (-40 C to +85 C)
Nivel de sensibilidad a la humedad (MSL) — 3 (per JEDEC J-STD-020)
Floor Life at MSL3 — 168 hours (factory conditions < 30 C / 60% RH)
Design Tool — Altera Quartus
Lead-Free Reflow Compatible — Yes (peak 220 C)
Voltage Supply — [DATA_NEEDED: VCCINT / VCCIO]

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