EP2A40F33C-9 vs EP2A40F33I-7 비교
다음의 상세 나란히 비교: EP2A40F33C-9 제조: Intel 및 EP2A40F33I-7 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2A40F33C-9 | EP2A40F33I-7 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $78.00 | $119.00 |
| Family | APEX II | — |
| Maximum System Gates | 1,600,000 | — |
| Embedded RAM | 65 Kbytes (approximately 540 Kbits depending on configuration) | — |
| 패키지 | 672-ball FineLine BGA (F33), 1.27 mm pitch | — |
| Speed Grade | -9 | — |
| 동작 온도 | 0C to +85C (commercial) | — |
| Process Technology | 0.15 micrometer CMOS | Altera APEX II CMOS programmable logic |
| PLLs | 4 | — |
| LVDS Channels | 16 high-speed LVDS channels | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | [DATA_NEEDED: logic element count] |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Multi-Core Architecture | MegaLAB structure with embedded memory and CAM | — |
| Configuration Method | JTAG, serial PROM, parallel flash | JTAG / serial configuration flash |
| MSL 레벨 | 3 | — |
| Peak Reflow Temperature | 220 C | 220 C (Pb-free profile) |
| RoHS 상태 | [DATA_NEEDED: not stated in provided data] | [DATA_NEEDED: RoHS compliance per PCN] |
| Core Voltage | [DATA_NEEDED: nominal core voltage] | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| Device Family | — | APEX II (EP2A) |
| Device Member | — | EP2A40 (high-density) |
| Package Type | — | Fine-pitch BGA (FBGA) |
| Package Pin/Ball Count | — | 33 balls |
| Pitch | — | [DATA_NEEDED: ball pitch] |
| Operating Temperature Grade | — | Industrial (-40 C to +85 C) |
| 습도 민감도 레벨 (MSL) | — | 3 (per JEDEC J-STD-020) |
| Floor Life at MSL3 | — | 168 hours (factory conditions < 30 C / 60% RH) |
| Design Tool | — | Altera Quartus |
| Lead-Free Reflow Compatible | — | Yes (peak 220 C) |
| Voltage Supply | — | [DATA_NEEDED: VCCINT / VCCIO] |