EP2A40F33C-9 vs EP2A40F33I-7 对比
详细并排对比 EP2A40F33C-9 出自 Intel 和 EP2A40F33I-7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2A40F33C-9 | EP2A40F33I-7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $78.00 | $119.00 |
| Family | APEX II | — |
| Maximum System Gates | 1,600,000 | — |
| Embedded RAM | 65 Kbytes (approximately 540 Kbits depending on configuration) | — |
| 封装 | 672-ball FineLine BGA (F33), 1.27 mm pitch | — |
| Speed Grade | -9 | — |
| 工作温度 | 0C to +85C (commercial) | — |
| Process Technology | 0.15 micrometer CMOS | Altera APEX II CMOS programmable logic |
| PLLs | 4 | — |
| LVDS Channels | 16 high-speed LVDS channels | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | [DATA_NEEDED: logic element count] |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Multi-Core Architecture | MegaLAB structure with embedded memory and CAM | — |
| Configuration Method | JTAG, serial PROM, parallel flash | JTAG / serial configuration flash |
| MSL 等级 | 3 | — |
| Peak Reflow Temperature | 220 C | 220 C (Pb-free profile) |
| RoHS 状态 | [DATA_NEEDED: not stated in provided data] | [DATA_NEEDED: RoHS compliance per PCN] |
| Core Voltage | [DATA_NEEDED: nominal core voltage] | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Device Family | — | APEX II (EP2A) |
| Device Member | — | EP2A40 (high-density) |
| Package Type | — | Fine-pitch BGA (FBGA) |
| Package Pin/Ball Count | — | 33 balls |
| Pitch | — | [DATA_NEEDED: ball pitch] |
| Operating Temperature Grade | — | Industrial (-40 C to +85 C) |
| 湿敏等级（MSL） | — | 3 (per JEDEC J-STD-020) |
| Floor Life at MSL3 | — | 168 hours (factory conditions < 30 C / 60% RH) |
| Design Tool | — | Altera Quartus |
| Lead-Free Reflow Compatible | — | Yes (peak 220 C) |
| Voltage Supply | — | [DATA_NEEDED: VCCINT / VCCIO] |