EP2A40F672C6N vs EP2A40F672C8N Vergleich

Detaillierter Direktvergleich von EP2A40F672C6N von Intel und EP2A40F672C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2A40F672C6N EP2A40F672C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $165,00 $122,00
Family APEX II APEX II
Logic Elements 40,000 —
Maximum System Gates 1,125,000 —
Embedded RAM Bits 442,368 —
Embedded System Blocks (ESBs) 160 —
Maximum User I/O Pins [DATA_NEEDED: maximum user I/O count] —
Core Voltage 1.5 V —
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V —
Gehäuse 672-ball FineLine BGA —
Betriebstemperatur Commercial (0C to +85C) —
Speed Grade C6 (per part number suffix) C8
Configuration Methods Passive Serial, Passive Parallel, JTAG —
Montageart Surface Mount —
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Process Technology SRAM-based, 0.18 um (per family datasheet) —
PLL Count [DATA_NEEDED: PLL count] —
Series — EP2A40
Logic Family — CMOS
System Gates — 1.5 M
Logic Elements / Cells — 38,400
Maximum Operating Frequency — 376 MHz
Propagation Delay — 1.55 ns
Technology Node — 0.15 µm
Process Feature — All-layer copper, up to 8 metal layers
Nominal Supply Voltage (VCCINT) — 1.5 V
Supply Voltage Range — 1.425 V to 1.575 V
User I/Os — 492
Number of Pins / Balls — 672
Package Type — FC-FBGA (FineLine BGA)
Package Dimensions — 27 x 27 mm
Ball Pitch — 1.0 mm
LVDS Data Rate — 1 Gbps
Embedded PLLs — 4
Programming Interface — JTAG (IEEE 1149.1)
Operating Temperature (Commercial) — 0 °C to 85 °C

Datenblätter & Ressourcen

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