EP2AGX190FF35I3G vs EP2AGZ225FF35I3G Vergleich
Detaillierter Direktvergleich von EP2AGX190FF35I3G von Altera und EP2AGZ225FF35I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Altera
EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera
EP2AGX190FF35I3G ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP2AGX190FF35I3G | EP2AGZ225FF35I3G |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.840,00 | $4.400,00 |
| Family | Arria II GX | — |
| Logic Elements (LE) | 181,165 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 612 | — |
| Embedded Memory (bits) | 10,177,536 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | 8 high-speed transceiver channels (multi-gigabit) | 12 channels |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | 1,728 18x18 |
| PLLs | [DATA_NEEDED: PLL count] | 8 |
| Core Voltage | 0.9 V | 0.9 V |
| I/O Voltage Standards | 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) | — |
| Process Node | 40 nm | — |
| Betriebstemperatur | -40 °C to +100 °C (industrial, suffix I) | -40C to +100C (Industrial) |
| Speed Grade | 3 | I3 |
| Gehäuse | 1152-ball FC-FBGA (FF35), 35 mm body | 1152-BGA (FBGA, FineLine BGA) |
| Ball Pitch | [DATA_NEEDED: 1.0 mm (typical for FF35)] | — |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount |
| RoHS-Status | Compliant (suffix G) | Compliant |
| Lead-Free | Yes | — |
| Programming Toolchain | Quartus II / Quartus Prime | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Arria II GZ |
| Device Family | — | EP2AGZ |
| Logic Elements | — | 225,000 |
| User I/O | — | 554 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Embedded Memory | — | 17.4 Mbits |
| On-chip RAM | — | 1,152 Kbits |
| DLLs | — | 8 |
| Process Technology | — | 40 nm TSMC |
| Packaging | — | Tray |