EP2AGX190FF35I3G vs EP2AGZ225FF35I3G Comparación
Comparación detallada lado a lado de EP2AGX190FF35I3G por Altera y EP2AGZ225FF35I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera
EP2AGX190FF35I3G ⚠ Última compra
Comparación de especificaciones
| Parámetro | EP2AGX190FF35I3G | EP2AGZ225FF35I3G |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.840,00 | $4.400,00 |
| Family | Arria II GX | — |
| Logic Elements (LE) | 181,165 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 612 | — |
| Embedded Memory (bits) | 10,177,536 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | 8 high-speed transceiver channels (multi-gigabit) | 12 channels |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | 1,728 18x18 |
| PLLs | [DATA_NEEDED: PLL count] | 8 |
| Core Voltage | 0.9 V | 0.9 V |
| I/O Voltage Standards | 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) | — |
| Process Node | 40 nm | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (industrial, suffix I) | -40C to +100C (Industrial) |
| Speed Grade | 3 | I3 |
| Encapsulado | 1152-ball FC-FBGA (FF35), 35 mm body | 1152-BGA (FBGA, FineLine BGA) |
| Ball Pitch | [DATA_NEEDED: 1.0 mm (typical for FF35)] | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount |
| Estado RoHS | Compliant (suffix G) | Compliant |
| Lead-Free | Yes | — |
| Programming Toolchain | Quartus II / Quartus Prime | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Arria II GZ |
| Device Family | — | EP2AGZ |
| Logic Elements | — | 225,000 |
| User I/O | — | 554 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Embedded Memory | — | 17.4 Mbits |
| On-chip RAM | — | 1,152 Kbits |
| DLLs | — | 8 |
| Process Technology | — | 40 nm TSMC |
| Packaging | — | Tray |