EP2AGX190FF35I3G vs EP2AGZ225FF35I3G Comparaison
Comparaison détaillée côte à côte de EP2AGX190FF35I3G par Altera et EP2AGZ225FF35I3G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Altera
EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera
EP2AGX190FF35I3G ⚠ Dernier achat
Comparaison des spécifications
| Paramètre | EP2AGX190FF35I3G | EP2AGZ225FF35I3G |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 840,00 | $4 400,00 |
| Family | Arria II GX | — |
| Logic Elements (LE) | 181,165 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 612 | — |
| Embedded Memory (bits) | 10,177,536 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | 8 high-speed transceiver channels (multi-gigabit) | 12 channels |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | 1,728 18x18 |
| PLLs | [DATA_NEEDED: PLL count] | 8 |
| Core Voltage | 0.9 V | 0.9 V |
| I/O Voltage Standards | 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) | — |
| Process Node | 40 nm | — |
| Température de fonctionnement | -40 °C to +100 °C (industrial, suffix I) | -40C to +100C (Industrial) |
| Speed Grade | 3 | I3 |
| Boîtier | 1152-ball FC-FBGA (FF35), 35 mm body | 1152-BGA (FBGA, FineLine BGA) |
| Ball Pitch | [DATA_NEEDED: 1.0 mm (typical for FF35)] | — |
| Type de montage | Surface Mount (flip-chip BGA) | Surface Mount |
| Statut RoHS | Compliant (suffix G) | Compliant |
| Lead-Free | Yes | — |
| Programming Toolchain | Quartus II / Quartus Prime | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Arria II GZ |
| Device Family | — | EP2AGZ |
| Logic Elements | — | 225,000 |
| User I/O | — | 554 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Embedded Memory | — | 17.4 Mbits |
| On-chip RAM | — | 1,152 Kbits |
| DLLs | — | 8 |
| Process Technology | — | 40 nm TSMC |
| Packaging | — | Tray |