EP2AGZ225FF35I4G vs EP2AGZ225FF35I3N Vergleich

Detaillierter Direktvergleich von EP2AGZ225FF35I4G von Intel und EP2AGZ225FF35I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ225FF35I4G EP2AGZ225FF35I3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.450,00 $2.655,00
Family Arria II GZ Arria II GZ
Logic Elements ~224,000 LE —
Process Node 40 nm —
Number of I/O 554 user I/O —
Package Type 1152-ball FineLine BGA (FBGA) —
Package Code FF35 —
Operating Temperature Grade Industrial (-40C to +100C) —
Speed Grade I4 —
Versorgungsspannung [DATA_NEEDED: core VCC voltage] —
Embedded Transceivers Multi-gigabit (per datasheet) —
DSP Blocks Yes (per Arria II GZ family) —
Embedded Memory Yes (per Arria II GZ family) 14,248,960 bits (approx. 14.25 Mbit)
PCI Express Hard IP Yes (Gen1/Gen2) —
External Memory Interface DDR3 controller (per family) —
Montageart Surface Mount (BGA) Surface Mount
MSL-Level [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: MSL rating]
RoHS-Status Compliant (per distributor listing) [DATA_NEEDED: RoHS status]
Lead-Free Yes (per distributor listing) —
Logic Elements (LE) — 224,000
Logic Array Blocks (LABs) — 8,960
User I/O Count — 554
Maximum Transceiver Data Rate — 6.375 Gbps
Transceiver Channels — 24
Process Technology — 40 nm
Core Voltage — 0.9 V
Betriebstemperatur — -40C to +100C (Industrial)
Gehäuse — 1152-ball FC-FBGA
Configuration Method — SRAM-based (volatile, requires external config device)
Maximum User I/O — 554

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern