EP2AGZ225FF35I4G vs EP2AGZ225FF35I3N 对比

详细并排对比 EP2AGZ225FF35I4G 出自 Intel 和 EP2AGZ225FF35I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2AGZ225FF35I4G EP2AGZ225FF35I3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1,450.00 $2,655.00
Family Arria II GZ Arria II GZ
Logic Elements ~224,000 LE —
Process Node 40 nm —
Number of I/O 554 user I/O —
Package Type 1152-ball FineLine BGA (FBGA) —
Package Code FF35 —
Operating Temperature Grade Industrial (-40C to +100C) —
Speed Grade I4 —
电源电压 [DATA_NEEDED: core VCC voltage] —
Embedded Transceivers Multi-gigabit (per datasheet) —
DSP Blocks Yes (per Arria II GZ family) —
Embedded Memory Yes (per Arria II GZ family) 14,248,960 bits (approx. 14.25 Mbit)
PCI Express Hard IP Yes (Gen1/Gen2) —
External Memory Interface DDR3 controller (per family) —
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: MSL rating]
RoHS 状态 Compliant (per distributor listing) [DATA_NEEDED: RoHS status]
Lead-Free Yes (per distributor listing) —
Logic Elements (LE) — 224,000
Logic Array Blocks (LABs) — 8,960
User I/O Count — 554
Maximum Transceiver Data Rate — 6.375 Gbps
Transceiver Channels — 24
Process Technology — 40 nm
Core Voltage — 0.9 V
工作温度 — -40C to +100C (Industrial)
封装 — 1152-ball FC-FBGA
Configuration Method — SRAM-based (volatile, requires external config device)
Maximum User I/O — 554

数据手册与资源

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