EP2AGZ300FH29C3G vs EP2AGZ300FH29I4G Comparison
Detailed side-by-side comparison of EP2AGZ300FH29C3G by Intel and EP2AGZ300FH29I4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ300FH29C3G | EP2AGZ300FH29I4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,545.00 | $1,350.00 |
| Series | Arria II GZ | β |
| Manufacturer | Intel (Altera) | β |
| Logic Elements | 300,000 | β |
| Number of I/O | 281 | 281 |
| Package | 780-BGA (HBGA, 29 mm) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (commercial, speed grade 3) | β |
| Speed Grade | 3 | I4 |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | 0.9 V (typical) |
| Process Node | 40 nm | 40 nm TSMC |
| Embedded Memory | M9K / M144K block RAM | β |
| DSP Blocks | Yes (variable-precision DSP) | Yes (variable-precision, per family) |
| Transceivers | Yes (multi-gigabit) | Embedded multi-gigabit transceivers (per family) |
| RoHS Status | Compliant | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020, where stated) | [DATA_NEEDED: MSL rating] |
| Family | β | Arria II GZ (AGZ) |
| Logic Elements (LE) | β | 300,000 (approx., per family member) |
| Package Type | β | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | β | FH29 (29x29 mm) |
| Operating Temperature Range | β | -40C to +100C (industrial, I-grade) |
| Configuration Method | β | JTAG / Passive Serial / Fast Passive Parallel |
| Block RAM | β | Embedded M9K / M144K blocks |
| Lead-Free | β | Yes (per RoHS) |