EP2AGZ300FH29I3G vs EP2AGZ350FH29I3G Vergleich
Detaillierter Direktvergleich von EP2AGZ300FH29I3G von Intel und EP2AGZ350FH29I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2AGZ300FH29I3G | EP2AGZ350FH29I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.340,00 | $1.450,00 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 300,000 | 350000 (approximately) |
| Embedded Memory | 18,520 Kbits | — |
| DSP Blocks (18x18 multipliers) | 720 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Number of Transceivers | 24 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Gehäuse | 780-pin FineLine BGA (FH29), 29x29 mm | 780-FBGA (FineLine BGA, FH29) |
| Speed Grade | -3 | — |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Operating Voltage (Core) | 0.9 V | — |
| External Memory Interface | DDR3 up to 800 MHz | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| User I/O Count | — | 281 |
| Betriebstemperaturbereich | — | -40C to +100C |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceivers | — | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) |
| Memory Interface | — | DDR3 with read/write leveling support (family feature) |
| Embedded Multipliers | — | 18x18 hardware multipliers (family feature) |
| Configuration Method | — | Serial or parallel via Quartus II (family feature) |
| MSL-Level | — | 3 (per BGA package handling guidelines) |
| Lead Free | — | Yes |
| Halogenfrei | — | [DATA_NEEDED: halogen free status] |