EP2AGZ300FH29I3G vs EP2AGZ350FH29I3G 对比
详细并排对比 EP2AGZ300FH29I3G 出自 Intel 和 EP2AGZ350FH29I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGZ300FH29I3G | EP2AGZ350FH29I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,340.00 | $1,450.00 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 300,000 | 350000 (approximately) |
| Embedded Memory | 18,520 Kbits | — |
| DSP Blocks (18x18 multipliers) | 720 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Number of Transceivers | 24 | — |
| Process Node | 40 nm TSMC | 40 nm |
| 封装 | 780-pin FineLine BGA (FH29), 29x29 mm | 780-FBGA (FineLine BGA, FH29) |
| Speed Grade | -3 | — |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Operating Voltage (Core) | 0.9 V | — |
| External Memory Interface | DDR3 up to 800 MHz | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | Compliant | Compliant |
| User I/O Count | — | 281 |
| 工作温度范围 | — | -40C to +100C |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceivers | — | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) |
| Memory Interface | — | DDR3 with read/write leveling support (family feature) |
| Embedded Multipliers | — | 18x18 hardware multipliers (family feature) |
| Configuration Method | — | Serial or parallel via Quartus II (family feature) |
| MSL 等级 | — | 3 (per BGA package handling guidelines) |
| Lead Free | — | Yes |
| 无卤 | — | [DATA_NEEDED: halogen free status] |